Whisker Growth Behavior of Sn58Bi Solder Coatings Under Isothermal Aging
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- 作者：Limin Ma ; Yong Zuo ; Sihan Liu ; Fu Guo
- 关键词：Sn58Bi coating ; bi ; rich whisker ; isothermal aging ; Cu6Sn5
- 刊名：Journal of Electronic Materials
- 出版年：2016
- 出版时间：January 2016
- 年：2016
- 卷：45
- 期：1
- 页码：44-50
- 全文大小：2,180 KB
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Yong Zuo (1)
Sihan Liu (1)
Fu Guo (1)
1. College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chao Yang District, Beijing, 100124, China - 刊物类别：Chemistry and Materials Science
- 刊物主题：Chemistry
Optical and Electronic Materials
Characterization and Evaluation Materials
Electronics, Microelectronics and Instrumentation
Solid State Physics and Spectroscopy - 出版者：Springer Boston
- ISSN：1543-186X
文摘
Whisker formation is a frequently occurring problem in the electronica industry, causing damage to fine-pitch electrical components. Several theories and models have been developed to describe the whisker growth, and many attempts have been made to find solutions for this issue. Most of the previous literature addressed the formation of Sn whiskers, while some attention was focused on Bi-rich whiskers. Moreover, investigation of different types of whiskers would be beneficial for understanding of the fundamental processes behind of the whisker growth. In our work, we analyze and discuss the growth of Bi-rich whiskers in eutectic Sn58Bi solder coatings under isothermal aging conditions. A possible growth mechanism for Bi-whiskers in the coating is proposed. Two processes contributed to the whisker growth. One process was the chemical reaction between Cu and Sn atoms to form Cu6Sn5. Cu atoms were inexhaustibly introduced into the coating from the substrate and caused the formation of Cu6Sn5. This process provided the driving force and was a sufficient condition for the growth of Bi-rich whiskers. The second process was the segregation of Bi atoms driven by the gradient of the Bi atoms’ concentration. This process was the necessary condition for Bi-whiskers growth.