Investigation of Whisker Growth from Alkaline Non-cyanide Zinc Electrodeposits

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• 作者：L. Wu ; M. A. Ashworth ; G. D. Wilcox
• 关键词：Whiskers ; zinc ; electrodeposition ; mechanisms
• 刊名：Journal of Electronic Materials
• 出版年：2017
• 出版时间：February 2017
• 年：2017
• 卷：46
• 期：2
• 页码：1114-1127
• 全文大小：12962KB
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Optical and Electronic Materials; Characterization and Evaluation of Materials; Electronics and Microelectronics, Instrumentation; Solid State Physics;
• 出版者：Springer US
• ISSN：1543-186X
• 卷排序：46

文摘

Electroplated zinc finishes have been widely used in the packaging of electronic products for many years as a result of their excellent corrosion resistance and relatively low cost. However, the spontaneous formation of whiskers on zinc electroplated components, which are capable of resulting in electrical shorting or other damaging effects, can be highly problematic for the reliability of long-life electrical and electronic equipment. This work investigated the mechanism for whisker growth from zinc electrodeposited mild steel substrates. The incubation time for whisker growth from the surface of nodules on the surface of the electrodeposit was considerably reduced compared with that from the planar deposit surface. Recrystallisation of the as-deposited columnar structure was observed at the whisker root. This result is consistent with some recent whisker growth models based on recrystallisation. There was no evidence of iron-zinc (Fe-Zn) intermetallic formation at the iron/zinc (Fe/Zn) interface or within the zinc coating beneath the whiskers.