Thermal Properties, Electrochemical Behavior, and Microstructure of Zn-5Sn-2Cu-1.5Bi-xRE High-Temperature Solder

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• 作者：Fei Xing ; Xiaoming Qiu
• 关键词：electrochemical behavior ; high ; temperature solder ; mechanical property ; microstructure ; thermal properties
• 刊名：Journal of Materials Engineering and Performance
• 出版年：2015
• 出版时间：April 2015
• 年：2015
• 卷：24
• 期：4
• 页码：1679-1686
• 全文大小：2,473 KB
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• 刊物类别：Chemistry and Materials Science
• 刊物主题：Chemistry
  Characterization and Evaluation Materials
  Materials Science
  Tribology, Corrosion and Coatings
  Quality Control, Reliability, Safety and Risk
  Engineering Design
  
• 出版者：Springer New York
• ISSN：1544-1024

文摘

This paper reports the investigation on RE addition into a novel Zn-5Sn-2Cu-1.5Bi-xRE (ZSCB-xRE) high-temperature solder to improve its various performances. The effects of minor rare earth metal (RE) on the thermal properties, microstructure, and electrochemical behavior as well as the mechanical properties of ZSCB-xRE solders were studied. Results showed that when the addition of RE was ?.1?wt.%, the change in melting temperature of ZSCB-xRE solder was negligible, but the melting range of the solder alloy decreased. Meanwhile, the measured size, Λ, of nonaligned dendrites of primary ε dramatically increased from 57?±?0.5 to 147?±?1.3?μm, which plays interdependent roles on the resulting corrosion behavior. ZSCB-xRE solders with much RE content have much higher Λ. This is shown to be a driving-force leading to the increase in the corrosion resistance and mechanical properties of ZSCB-xRE solders.