Phase Equilibria of the Cu-Si-Sn System at 700 and 500?°C

详细信息    查看全文

• 作者：Yuanyuan Song ; Xuping Su ; Ya Liu ; Haoping Peng…
• 关键词：Cu ; Si ; Sn system ; intermetallics ; phase equilibria ; Sn ; based solder
• 刊名：Journal of Phase Equilibria and Diffusion
• 出版年：2015
• 出版时间：October 2015
• 年：2015
• 卷：36
• 期：5
• 页码：493-502
• 全文大小：2,009 KB
• 参考文献：1.B.P. Richards, C.L. Levoguer, C.P. Hunt, K. Nimmo, S. Peters, and P. Cusack, An Analysis of the Current Status of Lead-Free Soldering, NPL, ITRI and DTI Joint Report About Pb-free Soldering, January 1999
  2.IPC Roadmap, Guide for Assembly of Lead-Free Electronics, IPC, Northbrook, IL, 2000
  3.M. Abtew and G. Selvaduray, Lead-Free Solders in Microelectronics, Mater. Sci. Eng. R, 2000, 27(5), p 95-141CrossRef
  4.K. Suganuma, Advances in Lead-Free Electronics Soldering, Curr. Opin. Solid State Mater. Sci., 2001, 5(1), p 55-64MathSciNet CrossRef ADS
  5.K.N. Tu and R.D. Thompson, Kinetics of Interfacial Reaction in Bimetallic Cu-Sn Thin Films, Acta Metall., 1982, 30(5), p 947-952CrossRef
  6.A.J. Sunwoo, J.W. Morris, and G.K. Lucey, The Growth of Cu-Sn Intermetallics at a Pretinned Copper-Solder Interface, Metall. Trans. A, 1992, 23(4), p 1323-1332CrossRef
  7.B.J. Lee, N.M. Hwang, and H.M. Lee, Prediction of Interface Reaction Products Between Cu and Various Solder Alloys by Thermodynamic Calculation, Acta Mater., 1997, 45(5), p 1867-1874CrossRef
  8.S. Bader, W. Gust, and H. Hieber, Rapid Formation of Intermetallic Compounds Interdiffusion in the CuSn and NiSn Systems, Acta Metall., 1995, 43(1), p 329-337
  9.D.R. Frear, D. Grivas, and J.W. Morris, Parameters Affecting Thermal Fatigue Behavior of 60Sn-40Pb Solder Joints, J. Electron. Mater., 1989, 18, p 671-680CrossRef ADS
  10.P.L. Tu, Y.C. Chan, and J.K.L. Lai, Effect of Intermetallic Compounds on the Thermal Fatigue of Surface Mount Solder Joints, IEEE Trans. Compon. Packag. Manuf. Technol. B, 1997, 20(1), p 87-93CrossRef
  11.Y.C. Chan, P.L. Tu, A.C. So, and J.K.L. Lai, Effect of Intermetallic Compounds on the Shear Fatigue of Cu/63Sn-37Pb Solder Joints, IEEE Trans, Compon. Packag. Manuf. Technol. B, 1997, 20(4), p 463-469CrossRef
  12.L. Quan, D. Frear, D. Grivas, and J.W. Morris, Tensile Behavior of Pb-Sn Solder/Cu Joints, J. Electron. Mater., 1987, 16(3), p 203-208CrossRef ADS
  13.R.E. Pratt, E.I. Stromswold, and D.J. Quesnel, Effect of Solid-State Intermetallic Growth on the Fracture Toughness of Cu/63Sn-37Pb Solder Joints, Compon. Packag. Manuf. Technol. A, 1996, 19(1), p 134-141CrossRef
  14.M.H. Lee, D.H. Bae, D.H. Kim, and D.J. Sordelet, Synthesis of Ni-Based Bulk Metallic Glass Matrix Composites Containing Ductile Brass Phase by Warm Extrusion of Gas Atomized Powders, J. Mater. Res., 2003, 18(09), p 2101-2108CrossRef ADS
  15.N.F. Lashko, K.P. Sorokina, and A.N. Gorbunov, Strengthening of Silicon Monel, Met. Sci. Heat Treat., 1996, 6, p 48-49
  16.H. Okamoto, Cu-Si (Copper-Silicon), J. Phase Equilib. Diffus., 2012, 33(5), p 415-416CrossRef
  17.D. Shin, J.E. Saal, and Z.K. Liu, Thermodynamic Modeling of the Cu-Si System, CALPHAD, 2008, 32(3), p 520-526CrossRef
  18.J.H. Shim, C.S. Oh, B.J. Lee, and D.N. Lee, Thermodynamic Assessment of the Cu-Sn System, Z. Metallk., 1996, 87(3), p 205-212
  19.J. Miettinen, Thermodynamic Description of the Cu-Al-Sn System in the Copper-Rich Corner, Metall. Mater. Trans. A, 2002, 33(6), p 1639-1648CrossRef
  20.X.J. Liu, C.P. Wang, I. Ohnuma, R. Kainuma, and K. Ishida, Experimental Investigation and Thermodynamic Calculation of the Phase Equilibria in the Cu-Sn and Cu-Sn-Mn Systems, Metall. Mater. Trans. A, 2004, 35, p 1641-1654CrossRef
  21.W. Gierlotka, S.W. Chen, and S.K. Lin, Thermodynamic Description of the Cu-Sn System, J. Mater. Res., 2007, 22(11), p 3158-3165CrossRef ADS
  22.M. Li, Z.M. Du, C.P. Guo, and C.R. Li, Thermodynamic Optimization of the Cu-Sn and Cu-Nb-Sn Systems, J. Alloys Compd., 2009, 477(1), p 104-117CrossRef
  23.S. Fürtauer, D. Li, D. Cupid, and H. Flandorfer, The Cu-Sn Phase Diagram, Part I: New Experimental Results, Intermetallics, 2013, 34, p 142-147CrossRef
  24.D. Li, P. Franke, S. Fürtauer, D. Cupid, and H. Flandorfer, The Cu-Sn Phase Diagram Part II: New Thermodynamic Assessment, Intermetallics, 2013, 34, p 148-158CrossRef
  25.H.L. Lukas, I. Ansara, A.T. Dinsdale, and M.H. Rand (Eds.), COST507—Thermochemical Database for Light Metal Alloys, Vol. 18499, 1998, p 224-226
  26.V.T. Deshpande and D.B. Direshmukh, Thermal Expansion of Tin in the β-γ Transition Region, Acta Crystallogr., 1962, 15, p 294-295CrossRef
  27.M. Kantola and E. Tokola, X-ray Studies on the Thermal Expansion of Copper-Nickel Alloys, Ann. Acad. Sci. Fenn., 1967, 223, p 1-10
  28.J.A. Lee and G.V. Raynor, The Lattice Spacings of Binary Tin-Rich Alloys, Proc. Phys. Soc. B, 1954, 67(10), p 737CrossRef ADS
  29.H. Kn?dler, über Kristallstruktur und strukturellen Zusammenhang der Phasen gamma und epsilon im System Kupfer-Zinn, Metall, 1966, 20(8), p 823-829, in German
  30.M.H. Booth, J.K. Brandon, R.Y. Brizard, C.T. Chieh, and W.B. Pearson, Brasses with F Cells, Acta Crystallogr. Sect. B Struct. Sci., 1977, 33(1), p 30-36CrossRef
  31.J.K. Brandon, W.B. Pearson, and D.J.N. Tozer, A Single-Crystal X-ray Diffraction Study of the ζ Bronze Structure, Cu20Sn6, Acta
• 作者单位：Yuanyuan Song (1) (2)
  Xuping Su (1) (2)
  Ya Liu (1) (2) (3)
  Haoping Peng (1) (2)
  Changjun Wu (1) (2)
  Jianhua Wang (1) (2)
  
  1. School of Materials Science and Engineering, Changzhou University, Changzhou, 213164, China
  2. Jiangsu Key Laboratory of Materials Surface Science and Technology, Changzhou University, Changzhou, 213164, China
  3. Jiangsu Collaborative Innovation Center of Photovolatic Science and Engineering, Changzhou University, Changzhou, 213164, Jiangsu, People’s Republic of China
  
• 刊物类别：Physics and Astronomy
• 刊物主题：Physics
  Crystallography
  Thermodynamics
  Materials Science
  Engineering Thermodynamics and Transport Phenomena
  Ceramics,Glass,Composites,Natural Materials
  Metallic Materials
  
• 出版者：Springer Boston
• ISSN：1863-7345

文摘

Intermetallic compounds formed in solder joints have a substantial effect on reliability. Because Sn-based alloys are alternatives to lead-containing solders, phase equilibria of the Cu-Si-Sn system were investigated for quenched samples annealed at 700 and 500 °C for 30 days. Nine three-phase equilibria were well established at 700 °C, and a previously unknown ternary τ phase with a possible homogeneity interval in the range Cu<sub>76sub>Sn<sub>7.8sub>Si<sub>16.2sub>-Cu<sub>85sub>Sn<sub>7.6sub>Si<sub>7.4sub> was found for the first time. The τ phase has a hexagonal structure with a = 8.012 nm and c = 5.04 nm. Six three-phase regions were identified in the isothermal region at 500 °C. In contrast with the isothermal region at 700 °C, the new ternary τ phase was not observed at 500 °C. The solubility of Si in ε-Cu<sub>3sub>Sn decreases from 12.8 to 1.4 at.%, and only small variations occur in the homogeneity ranges of η-Cu<sub>3sub>Si and γ-Cu<sub>5sub>Si. Keywords Cu-Si-Sn system intermetallics phase equilibria Sn-based solder