Fractal characteristics and microstructure evolution of magnetron sputtering Cu thin films
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- 作者：Shiwen Du (1)
Yongtang Li (1) - 关键词：fractal dimension ; metal thin film ; surface morphology ; microstructure evolution
- 刊名：Chinese Journal of Mechanical Engineering
- 出版年：2013
- 出版时间：January 2013
- 年：2013
- 卷：26
- 期：1
- 页码：137-143
- 全文大小：549KB
- 参考文献：1. ZHANG Guangping, WANG Zhongguang. Progress in fatigue of small dimensional materials[J]. / Acta Metallurgica Sinica. 2005, 41(1): 1鈥?. (in Chinese)
2. SIT J C, VICK D, ROBBIE K, et al. Thin film microstructure control using glacing angle deposition by sputtering[J]. / Journal of Materials Research, 1999, 14(4): 1 197鈥? 199. CrossRef
3. ROBBIE K, SHAFAI C, BREET M J. Thin films with nanometer-scale pillar microstructure[J]. / Journal of Materials Research, 1999, 14(7): 3 158鈥? 163. CrossRef
4. OHMI T, SAITO T, OTSUKI M, et al. Formation of copper films by a low kinetic energy particle process[J]. / Journal of the Electrochemical Society, 1991, 138(4): 1 089鈥? 097. CrossRef
5. KNORR D B, TRACY D P. A Reivew of microstructure in vapor deposited copper thin films[J]. / Materials Chemistry and Physics, 1995, 41(3): 206鈥?16. CrossRef
6. OKOLO B, LAMPARTER P, WELZEL U, et al. The effect of deposition parameters and substrate surface condition on texture, morphology and stress in magnetron-sputter-deposited Cu thin films[J]. / Thin Solid Films, 2005, 474: 50鈥?3. CrossRef
7. PETROV I, BARNA P B, HULTMAN L, et al. Microstructural evolution during film growth[J]. / J. Vac. Sci. Technol., 2003, A21(5): S117鈥揝128.
8. WANG Yuan, SONG Zhongxiao, XU Kewei. The surface mapping and crystal orientation of body-centered cubic thin metal tungsten films of different thickness[J]. / Acta Physica Sinica, 2007, 56(12): 7 248鈥? 254. (in Chinese)
9. CHU Wuyang. / Fractal theory in material science[M]. Beijing: Chemical Industry Press, 2004. (in Chinese)
10. LI Chao, ZHANG Jing, JIAO Yu, et al. Research on the relationship of different surfaces roughness and fractal dimensions of PEEK[J]. / Lubrication Engineering, 2011, 36(2): 17鈥?1. (in Chinese)
11. LI Chenggui, DONG shen. The parameters and methods of characterizing 3D surface microtopography[J]. / Journal of Astronaueic Metrology and Measurement, 1999, 19(6): 33鈥?3. (in Chinese)
12. GE Shirong, TONDER K. The fractal behavior and fractal characterization of rough surfaces[J]. / Tribology, 1997, 17(1): 73鈥?0.
13. BAO Liangman, CA Bo, LI Gongping, et al. AFM investigations of growth of Cu thin films deposited on silicon wafers[J]. / Vacuum & Cryogenics, 2005, 11(3): 159鈥?61. (in Chinese)
14. XIE Heping, WANG Jin鈥檃n, XIE Weihong. Fractal effect of surface roughness on the mechanical behavior of rock joints[J]. / Chaos, Solitons & Fractals, 1997, 8(2): 221鈥?52. CrossRef
15. ZHOU Chenghu, LUO Jianchen, YANG Xiaomei, et al. / Geological interpretation and analysis of remote sensing image[M]. Beijing: Science Press, 1999. (in Chinese)
16. ZHANG Huaguo, HUANG Weigen, ZHOU Changbao, et al. Fractal characterization of IKONOS imagery[J]. / Bulletin of Surveying and Mapping, 2005, 5: 15鈥?8. (in Chinese)
17. MAO Weimin. / Crystallographic structural and anisotropy of metal material[M]. Beijing: Science Press, 2002. (in Chinese)
18. SIM艕ES S, CALINA R, VIEIRA M T, et al. In-situ TEM study of grain growth in nanocrystalline copper thin films[J]. / Nanotechnology, 2010, 21(14): 145 701鈥?45 712. - 作者单位：Shiwen Du (1)
Yongtang Li (1)
1. School of Materials Science and Engineering, Taiyuan University of Science and Technology, Taiyuan, 030024, China - ISSN：2192-8258
文摘
How to describe surface morphology characteristic and microstructure evolution are the hottest researches of current thin film researches. But in traditional characterization of surface morphology, the roughness parameters are scale related. And the microstructure evolution of thin film during post-treatment is usually not considered in detail. To give a better understanding of the roughness of thin films topography, fractal method is carried out. In addition, microstructure evolution of thin films is analyzed based on the crystallography and energy theory. Cu thin films are deposited on Si (100) substrates by magnetron sputtering, and then annealed at different temperatures. Surface topography is characterized by atomic force microscope (AFM). Triangular prism surface area (TPSA) algorithm is used to calculate the fractal dimension of the AFM images. Apparent scale effect exists between the surface morphology roughness and film thickness. Relationship between the fractal dimension and roughness is analyzed by linear regression method and linear relationship exists between fractal dimension and surface roughness root mean square (RMS). Fractal dimension can be characterized as a scale independence parameter to represent the complex degree and roughness level of surface. With the increase of annealing temperature, surface roughness and fractal dimension decrease. But when the annealing temperature exceeds the recrystallization temperature, due to the agglomeration and coalescence of Cu grain, surface roughness and fractal dimension increase. Scale effect and changing regularity of grain growth and shape evolution for different film thickness under different annealing temperatures are analyzed. Based on minimum total free energy, regularity of grain growth and changing is proposed. The proposed research has some theory significance and applicative value of Cu interconnect process and development of MEMS.