Mass transport phenomena in copper nanowires at high current density

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• 作者：Yu-Ting Huang ; Chun-Wei Huang ; Jui-Yuan Chen ; Yi-Hsin Ting…
• 刊名：Nano Research
• 出版年：2016
• 出版时间：April 2016
• 年：2016
• 卷：9
• 期：4
• 页码：1071-1078
• 全文大小：1,658 KB
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Chinese Library of Science
  Chemistry
  Nanotechnology
  
• 出版者：Tsinghua University Press, co-published with Springer-Verlag GmbH
• ISSN：1998-0000
• 卷排序：9

文摘

Electromigration in Cu has been extensively investigated as the root cause of typical breakdown failure in Cu interconnects. In this study, Cu nanowires connected to Au electrodes are fabricated and observed using in situ transmission electron microscopy to investigate the electro- and thermo-migration processes that are induced by direct current sweeps. We observe the dynamic evolution of different mass transport mechanisms. A current density on the order of 106 A/cm2 and a temperature of approximately 400 °C are sufficient to induce electro- and thermo-migration, respectively. Observations of the migration processes activated by increasing temperatures indicate that the migration direction of Cu atoms is dependent on the net force from the electric field and electron wind. This work is expected to support future design efforts to improve the robustness of Cu interconnects.