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High-temperature deformation behavior of titanium clad steel plate
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  • 作者:Shang-Wu Zeng ; Ai-Min Zhao ; Hai-Tao Jiang ; Xiao-Qian Yan ; Ji-Xiong Liu…
  • 关键词:Titanium clad steel plate ; Hot deformation simulation ; Metal flow behavior ; Stress
  • 刊名:Rare Metals
  • 出版年:2015
  • 出版时间:November 2015
  • 年:2015
  • 卷:34
  • 期:11
  • 页码:764-769
  • 全文大小:1,527 KB
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  • 作者单位:Shang-Wu Zeng (1) (2)
    Ai-Min Zhao (1) (2)
    Hai-Tao Jiang (1)
    Xiao-Qian Yan (1)
    Ji-Xiong Liu (3)
    Xiao-Ge Duan (1)

    1. Engineering Research Institute, University of Science and Technology Beijing, Beijing, 100083, China
    2. Beijing Laboratory of Metallic Materials and Processing for Modern Transportation, Beijing, 100083, China
    3. Baoti Research Institute, Baoti Group Co., Ltd., Baoji, 721014, China
  • 刊物类别:Chemistry and Materials Science
  • 刊物主题:Chemistry
    Metallic Materials
    Chinese Library of Science
  • 出版者:Journal Publishing Center of University of Science and Technology Beijing, in co-publication with Sp
  • ISSN:1867-7185
文摘
In this paper, the single-pass hot compression experiment of titanium clad steel plate was carried out by Gleeble-3500 thermal mechanics simulation test machine, and the effect of deformation temperature (T), strain rate (\( \dot{\varepsilon } \)), thickness ratio (k), and friction coefficient (μ) on flow pattern of the metal and stress in the deformation zone was analyzed. The results show that the metal flow behavior and the stress during compressive deformation depend strongly on the deformation temperature. At 800 and 850 °C, the bimetal can flow uniformly, while at 900 °C, the TA2 flows faster than Q235B, and the phenomenon of TA2 wrapping Q235B is observed. The metal flow of the bimetal material will coordinate each other through the bonding interface. It is noted that the stress increases with the increase of the \( \dot{\varepsilon } \) and μ and decreases when the metal flows along the contact area. Keywords Titanium clad steel plate Hot deformation simulation Metal flow behavior Stress

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