基于MMC结温波动优化的预测控制策略及其可靠性分析
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摘要
模块化多电平换流器(MMC)IGBT子模块的平均结温及其波动会显著影响其失效率,进而对系统的可靠性产生影响。在MMC热平衡算法的基础上,分析如何在降低MMC子模块结温分布差异和保持子模块的电容电压波动不变的前提下,只通过改变子模块的投切过程来降低结温波动的可能性。以接近结温波动的最小理论幅值ΔT_(min)、降低子模块间的结温波动差异为目标,结合预测得到的下一个控制周期中器件的结温,给出温度波动优化的控制策略。采用Coffin-Manson寿命模型和线性累计损伤理论,评估温度优化控制策略下MMC系统的寿命。最后,在MATLAB中搭建10电平仿真模型,仿真结果表明通过对MMC系统进行温度控制可以提高系统的可靠性。
The average junction temperature and the fluctuation of IGBT submodule of MMC(Modular Multilevel Converter) greatly impact its failure rate and further impact the system reliability. Based on the MMC thermal ba-lance algorithm,the possibility reduction of junction temperature fluctuation is analyzed only by changing the swit-ching process of the submodules,while the difference of junction temperature distribution of the MMC submodule is reduced and the capacitor voltage fluctuation of the submodules is set to be consistent. To reduce the difference of junction temperature fluctuation between submodules and approach the minimum theoretical amplitude ΔT_(min) of junction temperature fluctuation,an optimal control strategy of temperature fluctuation is proposed in combination with the predicted junction temperature of the device in the next control cycle. Using the Coffin-Manson life model and linear cumulative damage theory,the life of MMC system under temperature optimal control strategy is evaluated. Finally,a 10-level simulation model is built in MATLAB. Simulative results show that the temperature control of MMC system effectively improves the system reliability.
The average junction temperature and the fluctuation of IGBT submodule of MMC(Modular Multilevel Converter) greatly impact its failure rate and further impact the system reliability. Based on the MMC thermal ba-lance algorithm,the possibility reduction of junction temperature fluctuation is analyzed only by changing the swit-ching process of the submodules,while the difference of junction temperature distribution of the MMC submodule is reduced and the capacitor voltage fluctuation of the submodules is set to be consistent. To reduce the difference of junction temperature fluctuation between submodules and approach the minimum theoretical amplitude ΔT_(min) of junction temperature fluctuation,an optimal control strategy of temperature fluctuation is proposed in combination with the predicted junction temperature of the device in the next control cycle. Using the Coffin-Manson life model and linear cumulative damage theory,the life of MMC system under temperature optimal control strategy is evaluated. Finally,a 10-level simulation model is built in MATLAB. Simulative results show that the temperature control of MMC system effectively improves the system reliability.
引文
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[2] 王秀丽,郭静丽,庞辉.模块化多电平换流器的结构可靠性分析[J].中国电机工程学报,2016,36(7):1908-1914.WANG Xiuli,GUO Jingli,PANG Hui.Structural reliability analysis of modular multi-level converters[J].Proceedings of the CSEE,2016,36(7):1908-1914.
[3] 黄守道,付雪婷,饶宏.基于Semi-Markov的模块化多电平换流器的可靠性分析及其冗余配置策略[J].电力自动化设备,2018,38(7):128-133.HUANG Shoudao,FU Xueting,RAO Hong.Reliability analysis and redundant configuration strategy of MMC based on Semi-Markov[J].Electric Power Automation Equipment,2018,38(7):128-133.
[4] 李辉,邓吉利,姚然.计及运行工况的MMC换流阀可靠性建模与分析[J].电力自动化设备,2018,38(10):108-114.LI Hui,DENG Jili,YAO Ran.Reliability modeling and analysis of MMC converter valve considering operation conditions[J].Electric Power Automation Equipment,2018,38(10):108-114.
[5] 杨珍贵,杜雄,孙鹏菊.风电全功率变流器参数对可靠性的影响分析[J].电工技术学报,2015,30(16):137-145.YANG Zhengui,DU Xiong,SUN Pengju.Analysis of the influence of the parameters of the wind power full power converter on the relia-bility[J].Transaction of China Electrotechnical Sociaty,2015,30(16):137-145.
[6] 周湶,薛赛,李剑.风机中参数变化对变流器直流侧电容可靠性的影响分析[J].电力自动化设备,2017,37(11):22-26,31.ZHOU Quan,XUE Sai,LI Jian.Model parameter identification of DFIG based on short circuit current[J].Electric Power Automation Equipment,2017,37(11):22-26,31.
[7] HAHN F,ANDRESEN M,BUTICCHI G,et al.Thermal analysis and balancing for modular multilevel converters in HVDC applications[J].IEEE Transactions on Power Electronics,2018,33(3):1985-1996.
[8] SANGWONGWANICH A,MATHE L,TEODORESCU R,et al.Two-dimension sorting and selection algorithm featuring thermal balancing control for modular multilevel converters[C]//European Conference on Power Electronics and Applications.Karlsruhe,Germany:IEEE,2016:1-10.
[9] BAKHSHIZADEH M K,MA K,LOH P C,et al.Indirect thermal control for improved reliability of modular multilevel converter by utilizing circulating current[C]//Applied Power Electronics Conference and Exposition.Charlotte,USA:IEEE,2015:2167-2173.
[10] HAN X,YANG Q,WU L,et al.Analysis of thermal cycling stress on semiconductor devices of the modular multilevel converter for drive applications[C]//IEEE Applied Power Electronics Conference and Exposition.Long Beach,CA,USA:IEEE,2016:2957-2962.
[11] 饶宏,李建国,宋强,等.模块化多电平换流器直流输电系统损耗的计算方法及其损耗特性分析[J].电力自动化设备,2014,34(6):101-106.RAO Hong,LI Jianguo,SONG Qiang,et al.Method of loss calculation and analysis of loss character for MMC in DC transmission system[J].Electric Power Automation Equipment,2014,34(6):101-106.
[12] 刘飞.考虑结温波动的同相补偿变流器可靠性评估[D].成都:西南交通大学,2017.LIU Fei.Assessment of reliability for phase compensating converter considering junction temperature fluctuation[D].Chengdu:Southwest Jiaotong University,2017.
[13] 薛英林,徐政,张哲任,等.采用不同子模块的MMC-HVDC阀损耗通用计算方法[J].电力自动化设备,2015,35(1):20-29.XUE Yinglin,XU Zheng,ZHANG Zheren,et al.General method of valve loss calculation for MMC-HVDC with different submodules[J].Electric Power Automation Equipment,2015,35(1):20-29.
[14] BERGNA G,D'ARCO S,SUUL J A,et al.Analysis of power cycling for semiconductor devices in modular m ultilevel converters[C]// Control and Modeling for Power Electronics.Trondheim,Norway:IEEE,2016:1-7.