一种具有优异介电性能的高Tg无卤型覆铜板的介绍
|
摘要
信息产业飞速发展,覆铜板应用领域对板材的介电性能越来越关注,在对覆铜板性能要求越来越高的时候,又不能忽视当下世界对环保的重视,具有较低介电性能的无卤型覆铜板无疑是最佳的开发之选。文章主要介绍了以改性环氧树脂,结合苯并噁嗪树脂进行固化,得到的一种具有优异介电性能的高Tg无卤型覆铜板。
With the rapid development of the information industry,the copper clad laminate application fields pay more and more attention to dielectric performance on sheet.With the increasingly high performance requirements today,we also cannot ignore the present world attention to environmental protection.Undoubtedly,the low dielectric properties of halogen free copper clad panel is the best development choice to meet these requirements.This paper mainly introduces the method of getting a high Tg Halogen-free CCL with good dielectric properties type copper clad laminate.We mainly solidify the modified epoxy resins combined with benzene resins.
With the rapid development of the information industry,the copper clad laminate application fields pay more and more attention to dielectric performance on sheet.With the increasingly high performance requirements today,we also cannot ignore the present world attention to environmental protection.Undoubtedly,the low dielectric properties of halogen free copper clad panel is the best development choice to meet these requirements.This paper mainly introduces the method of getting a high Tg Halogen-free CCL with good dielectric properties type copper clad laminate.We mainly solidify the modified epoxy resins combined with benzene resins.
引文
[1]王元宏.阻燃剂化学及其应用[M].上海科学技术文献出版社,1988.
[2]Grand A F.Wilkie C A Fire Retardancy of polymericMaterials[M].New York:Karcel Dekker,Inc,2000.
[3]欧育湘,陈宇,王筱梅.阻燃高分子材料[M].北京:国防工业出版社,2001,1.
[4]陈晓勇.含磷阻燃环氧树脂体系的研究进展[J].合成技术及应用,2009,24(4):39-44.
[5]王新龙,韩平.环境友好阻燃环氧树脂覆铜板研究进展[J].电子元件与材料,2002,21(7):32-35.
[6]欧育湘,钟柳,刘进全.无卤本质阻燃环氧树脂[J].高分子材料科学与工程,2006,22(5):240-244.
[7]凌鸿.一种新型无卤阻燃覆铜板的制备及阻燃机理的研究[D].四川大学,2003.
[8]Sanny He,Jeng-I Chen,Elren Zhang ITEQ Newgenetation low dielectric constant and loss material forhigh frequency application.CPCA 2008 conferencereport.
[2]Grand A F.Wilkie C A Fire Retardancy of polymericMaterials[M].New York:Karcel Dekker,Inc,2000.
[3]欧育湘,陈宇,王筱梅.阻燃高分子材料[M].北京:国防工业出版社,2001,1.
[4]陈晓勇.含磷阻燃环氧树脂体系的研究进展[J].合成技术及应用,2009,24(4):39-44.
[5]王新龙,韩平.环境友好阻燃环氧树脂覆铜板研究进展[J].电子元件与材料,2002,21(7):32-35.
[6]欧育湘,钟柳,刘进全.无卤本质阻燃环氧树脂[J].高分子材料科学与工程,2006,22(5):240-244.
[7]凌鸿.一种新型无卤阻燃覆铜板的制备及阻燃机理的研究[D].四川大学,2003.
[8]Sanny He,Jeng-I Chen,Elren Zhang ITEQ Newgenetation low dielectric constant and loss material forhigh frequency application.CPCA 2008 conferencereport.