聚四氟乙烯乳液在高频覆铜板中的应用
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摘要
简述了聚四氟乙烯(PTFE)覆铜板的结构和制造工艺,概括了国内外的发展情况,通过对比指出了PTFE覆铜板行业国内外的差距,要突破国外垄断,仍面临巨大的挑战。对PTFE覆铜板行业未来的发展趋势作了总结,主要是开发多层化、性能稳定的基板和相应的粘结片,降低覆铜板的热膨胀系数和介电常数,同时降低覆铜板的生产成本。
The development and manufacturing process of PTFE copper clad laminate(CCL) are briefly described,and point out that there are huge gap in the types and reliability of PTFE CCL products between China and abroad. Finally,the development trend of PTFE CCL industry is summarized. The main purpose is to develop PTFE CCL and bonding films accordingly which are multi-layered,highly reliable,low dielectric,and low-cost.
The development and manufacturing process of PTFE copper clad laminate(CCL) are briefly described,and point out that there are huge gap in the types and reliability of PTFE CCL products between China and abroad. Finally,the development trend of PTFE CCL industry is summarized. The main purpose is to develop PTFE CCL and bonding films accordingly which are multi-layered,highly reliable,low dielectric,and low-cost.
引文
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[25]祝大同.基板材料在车载毫米波雷达中应用及技术进展[J].印制电路信息,2016,24(7):30-36.
[26]祝大同.5G市场兴起对覆铜板行业发展的新驱动[J].印制电路资讯,2017(4):47-52.
[27]杨维生.高频多层PCB用粘结片现状及展望[J].覆铜板资讯,2016(5):17-21.
[28]James N K,Jacob K S,Murali K P,et al.Ba(Mg1/3Ta2/3)O3 filled PTFE composites for microwave substrate applications[J].Materials Chemistry and Physics,2010,122(2):507-511.
[29]Yuan Y,Wang J,Yao M,et al.Influence of Si O2addition on properties of PTFE/Ti O2microwave composites[J].Journal of Electronic Materials,2017,47(1):1-8.
[30]Sankar K P,Christopher J C,Dirk M B,et al.Circuit materials,circuits laminates,and method of manufacture thereof:US,20100015404[P].2010-01-21.
[2]粟俊华.低介电常数和低介质损耗覆铜板材料的介绍[J].印制电路信息,2011(4):17-24.
[3]祝大同.对未来覆铜板技术发展趋势的探讨[J].覆铜板资讯,2010(6):11-16.
[4]Murali K P,Rajesh S,Prakash O,et al.Preparation and properties of silica filled PTFE flexible laminates for microwave circuit applications[J].Composites Part A:Applied Science and Manufacturing,2009,40(8):1179-1185.
[5]Chen Y C,Lin H C,LEE Y D.The effects of phenyltrimethoxysilane coupling agents on the properties of PTFE/silica composites[J].Journal of Polymer Research,2004,11(1):1-7.
[6]Rajesh S,Nisa V S,Murali K P,et al.Microwave dielectric properties of PTFE/rutile nanocomposites[J].Journal of Alloys and Compounds,2009,477(1/2):677-682.
[7]宋永要,张立欣,庞子博,等.不同偶联剂对PTFE/Ca Ti O3复合材料性能的影响[J].压电与声光,2016,38(2):290-292.
[8]Anjana P S,Sebastian M T,Suma M N,et al.Low dielectric loss PTFE/Ce O2,ceramic composites for microwave substrate applications[J].International Journal of Applied Ceramic Technology,2008,5(4):325-333.
[9]杨维生.微波复合介质电路基板应用现状及其发展趋势[J].印制电路资讯,2015(1):93-96.
[10]钱知勉,包永忠.氟塑料加工与应用[M].北京:化学工业出版社,2010.
[11]江恩伟.聚四氟乙烯覆铜板的制造技术及发展趋势[J].印制电路信息,2013(10):5-7.
[12]台湾电路板产业学院.电路板湿制程全书[M].台湾:台湾电路板协会,2005.
[13]辜信实.PTFE覆铜板的制造技术[J].覆铜板资讯,2017(1):99-100.
[14]Arthur D J,Swei G S.Ceramic filled fluoropolymetric composite material:US,5024871[P].1991-06-18
[15]Paul S K,Caisse C J,Baars D M,et al.Circuit materials,circuits laminates,and method of manufacture thereof:US,8187696[P].2012-05-29.
[16]胡福田.高性能聚四氟乙烯覆铜板研究[D].广州:华南理工大学,2005.
[17]邵亚国,梁杰,邵爱国,等.一种聚四氟乙烯玻璃纤维复合材料基板的生产工艺:中国,105898984[P].2016-05-04.
[18]张立欣,宋永要,庞子博,等.一种微波复合介质基板制备方法:中国,104211320[P].2014-12-17.
[19]黄达斐,严长俊,李晓晨,等.陶瓷/PTFE复合介质基板新成型工艺的研究[J].电子元件与材料,2014,33(4):17-21.
[20]祝大同.高频微波基板材料行业的发展新动向-EDICNO China 2016展会纪实[J].覆铜板资讯,2016(4):1-9.
[21]陈涛,蔡成菁.胶槽及具有该胶槽的浸胶装置:中国,207413740[P].2018-05-29.
[22]杨乐,王立峰,杨涛,等.应用于印制电路板的钻孔设备:中国,207427580[P].2018-05-29.
[23]陈涛,蔡成菁,魏剑耀,等.一种粘结片的生产方法:中国,108215367[P].2018-06-29.
[24]杨维生,彭延辉.微波介质基板材料及选用[J].覆铜板资讯,2015(5):13-18.
[25]祝大同.基板材料在车载毫米波雷达中应用及技术进展[J].印制电路信息,2016,24(7):30-36.
[26]祝大同.5G市场兴起对覆铜板行业发展的新驱动[J].印制电路资讯,2017(4):47-52.
[27]杨维生.高频多层PCB用粘结片现状及展望[J].覆铜板资讯,2016(5):17-21.
[28]James N K,Jacob K S,Murali K P,et al.Ba(Mg1/3Ta2/3)O3 filled PTFE composites for microwave substrate applications[J].Materials Chemistry and Physics,2010,122(2):507-511.
[29]Yuan Y,Wang J,Yao M,et al.Influence of Si O2addition on properties of PTFE/Ti O2microwave composites[J].Journal of Electronic Materials,2017,47(1):1-8.
[30]Sankar K P,Christopher J C,Dirk M B,et al.Circuit materials,circuits laminates,and method of manufacture thereof:US,20100015404[P].2010-01-21.