低温共烧陶瓷基板表面精密图形激光加工技术研究
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摘要
低温共烧陶瓷结合了多层厚膜陶瓷电路和高温共烧陶瓷技术的优点,是一种优异的多层布线基板技术。阐述了现有LTCC表面图形加工方法及其优缺点。常规热加工激光去除技术会损伤陶瓷表面玻璃,因而不适合加工LTCC表面图形。在分析了紫外激光加工的原理后,提出用紫外激光对LTCC产品表面金属去除加工精密图形的方法。通过试验方案设计和数据分析,优化的激光工作频率为60 kHz、加工功率为3.0 W,并设计了不同关键尺寸图形进行加工,得到了紫外激光技术可以加工的图形极限尺寸为30μm,加工精度±10%。。
Low temperature co-fired ceramic has the advantages of multilayer thick film ceramic circuits and high temperature co-fired ceramic technology, and is an excellent multilayer wiring substrate. The existing LTCC surface graphics processing methods and their advantages and disadvantages were described. Conventional thermal processing of laser technology may damage ceramic surface, so it is not suitable for processing LTCC surface graphics. After analyzing the principle of ultraviolet laser processing, a method of removing the surface metal from LTCC products by ultraviolet laser is presented. Through the test design and data analysis, the optimized laser working frequency is 60 kHz and the processing power is 3 W. The different key size graphics were designed, the graphic limit size of the UV laser technology is 30 μm, and the machining precision is ±10%.
Low temperature co-fired ceramic has the advantages of multilayer thick film ceramic circuits and high temperature co-fired ceramic technology, and is an excellent multilayer wiring substrate. The existing LTCC surface graphics processing methods and their advantages and disadvantages were described. Conventional thermal processing of laser technology may damage ceramic surface, so it is not suitable for processing LTCC surface graphics. After analyzing the principle of ultraviolet laser processing, a method of removing the surface metal from LTCC products by ultraviolet laser is presented. Through the test design and data analysis, the optimized laser working frequency is 60 kHz and the processing power is 3 W. The different key size graphics were designed, the graphic limit size of the UV laser technology is 30 μm, and the machining precision is ±10%.
引文
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[3]侯旎璐,汪洋,刘清超.LTCC技术简介及其发展现状[J].电子工艺技术,2014,35(2):91-93.
[4]今中佳彦.多层低温共烧陶瓷技术[M].北京:科学出版社,2009.
[5]秦跃利,刘志辉,王春富,等.LTCC-D高密度微波集成工艺技术研究[J].电子工艺技术,2014,35(2):91-93.
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