降温速率对Bi-2223/AgAu带材微观结构和传输性能的影响（英文）
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摘要
采用PIT工艺制备了单芯Bi-2223/AgAu带材,系统地研究了第二次热处理阶段(HT2)降温速率对带材相组成、微观结构和传输性能的影响。结果表明:随着降温速率的减小,富铅相3321不断增加,CuO颗粒尺寸逐渐增大。当冷却速率从600℃/h减小到1℃/h时,临界电流密度Jc从7 kA/cm~2增加到11.5 kA/cm~2,增加了64%。由于晶间连接性能和磁通钉扎性能的提高,在较低的降温速率下,Bi-2223/AgAu带材在磁场下的临界电流密度也得到了提高。
Monofilament AgAu sheathed Bi-2223 tapes were fabricated by powder in tube(PIT)process.The influences of cooling rate during the second heat treatment process(HT2)on the phase composition,microstructures and transport properties of Bi-2223/Ag Au tapes were investigated.Results show that after the HT2 process,the content of Pb-rich Pb_3Sr_(2.5)Bi_(0.5)Ca_2Cu O_y(3321)phase increases with the decreasing cooling rate,while the size of Cu O phase particles becomes bigger.With the cooling rate decreasing from 600°C/h by 1°C/h,the critical current density J_(c )increases from 7 kA/cm~2 to the maximum value of 11.5 kA/cm~2,which increases by 64%.Meanwhile the current capacities in magnetic field of these Bi-2223/AgAu tapes have also been enhanced with slow cooling process,attributed to the improvements of both the intergrain connectivity and the flux pinning properties.
Monofilament AgAu sheathed Bi-2223 tapes were fabricated by powder in tube(PIT)process.The influences of cooling rate during the second heat treatment process(HT2)on the phase composition,microstructures and transport properties of Bi-2223/Ag Au tapes were investigated.Results show that after the HT2 process,the content of Pb-rich Pb_3Sr_(2.5)Bi_(0.5)Ca_2Cu O_y(3321)phase increases with the decreasing cooling rate,while the size of Cu O phase particles becomes bigger.With the cooling rate decreasing from 600°C/h by 1°C/h,the critical current density J_(c )increases from 7 kA/cm~2 to the maximum value of 11.5 kA/cm~2,which increases by 64%.Meanwhile the current capacities in magnetic field of these Bi-2223/AgAu tapes have also been enhanced with slow cooling process,attributed to the improvements of both the intergrain connectivity and the flux pinning properties.
引文
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13 Lelovic M,Deis T,Eror N G et al.Supercond Sci Technol[J],1996,9:965
14 Tetenbaum M,Maroni V A.Physica C[J],1996,260(1-2):71
15 Chen X P,Li M Y,Qu T M.Supercond Sci Technol[J],2003,16:1162
16 Yoo J M,Chung H S,Ko J W et al.Physica C[J],1996,267(1-2):53
17 Dorris S E,Prorok B C,Lanagan M T et al.Physica C[J],1993,212(1-2):66
18 Sung Y S,Hellstrom E E.Physica C[J],1995,253(1-2):79
19 Yamada Y,Obst B,Flukiger R.Supercond Sci Technol[J],1991,4:165
20 Chen F H,Koo H S,Tseng T Y.Appl Phys Lett[J],1991,58(6):637
21 Lanagan M T,Kupperman D S,Yaconi G A et al.IEEE Trans Appl Supercond[J],1995,5(2):1475
2 Sato K,Kato T,Hkura K O et al.Supercond Sci Technol[J],2000,13:18
3 Paul W,Lakner M,Rhyner J et al.Supercond Sci Technol[J],1997,10:914
4 Fujishiro H,Ikebe M,Noto K et al.IEEE Trans Appl Supercond[J],1994,30:1645
5 Grasso G,Jeremie A,Flukiger R.Supercond Sci Technol[J],1995,8:827
6 Yi H P,Song X H,Liu L et al.Physica C[J],2005,426-431:1176
7 Holesinger T G,Bingert J F,Willis J O et al.IEEE Trans Appl Supercond[J],2002,9(2):2440
8 Chen X P,Grivel J C,Li M Y et al.Physica C[J],2004,406(3-4):176
9 Sang S O,Kubota T,Osamura K.Physica C[J],1990,171(3-4):265
10 Huang Y B,Fuente G F,Larrea A et al.Supercond Sci Technol[J],1994,7:759
11 Yoshida K,Sano Y,Tommi Y.Supercond Sci Technol[J],1995,8:329
12 Parrell J A,Larbalestier D C,Riley G N et al.Appl Phys Lett[J],1996,69:2915
13 Lelovic M,Deis T,Eror N G et al.Supercond Sci Technol[J],1996,9:965
14 Tetenbaum M,Maroni V A.Physica C[J],1996,260(1-2):71
15 Chen X P,Li M Y,Qu T M.Supercond Sci Technol[J],2003,16:1162
16 Yoo J M,Chung H S,Ko J W et al.Physica C[J],1996,267(1-2):53
17 Dorris S E,Prorok B C,Lanagan M T et al.Physica C[J],1993,212(1-2):66
18 Sung Y S,Hellstrom E E.Physica C[J],1995,253(1-2):79
19 Yamada Y,Obst B,Flukiger R.Supercond Sci Technol[J],1991,4:165
20 Chen F H,Koo H S,Tseng T Y.Appl Phys Lett[J],1991,58(6):637
21 Lanagan M T,Kupperman D S,Yaconi G A et al.IEEE Trans Appl Supercond[J],1995,5(2):1475