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MOSFETs力/磁传感器集成化研究
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摘要
多功能集成传感器以其体积小、重量轻及集成一体化等诸多优点具有广阔应用领域。本文采用MEMS工艺技术在n型单晶硅片上腐蚀硅杯,再利用CMOS工艺技术在硅膜上的最大应力区范围内制作四个沟道互相平行的MOSFET,其中两个P-MOSFET置于硅敏感膜的径向位置,而另外两个P-MOSFET置于硅敏感膜的横向位置,将这四个P-MOSFET集成在一个管芯上组成惠斯通电桥,当硅敏感膜受压力时,硅膜发生微小变形,两个径向的P-MOSFET沟道等效电阻阻值增大,两个横向P-MOSFET沟道等效电阻阻值减小,惠斯通电桥产生力敏输出。在距离源极0.7个沟道长度的位置引出霍尔输出电极,对单一MOSFET霍尔器件来说,在垂直磁场作用下,沟道空穴在洛仑兹力作用下发生偏转,霍尔输出极产生霍尔输出电压VH,霍尔输出电压随磁感应强度改变而发生改变,实现对磁场的测量。
     本文介绍了MOSFETs力/磁传感器基本工作原理,并阐述了MOSFETs力/磁传感器的结构设计和制作工艺。在对MOSFETs力/磁传感器的I-V特性、温度特性进行了测试的基础上计算分析线性度、迟滞、重复性、灵敏度和精度等静态特性。实验结果表明,MOSFETs力/磁传感器的力敏灵敏度为11.5mV/100KPa,力敏线性度为1.36%F·S,力敏重复性为1.31%F·S,力敏迟滞为0.68%F·S,力敏精度为3.5%F·S;磁敏灵敏度为5.06mV/T,磁敏线性度为0.02%F·S,磁敏迟滞为1.01%F·S,磁敏重复性为1.48%F·S,磁敏精度为1.8%F·S,均符合设计要求。
     国内外对于压/磁多功能传感器的集成一体化研究尚未见文献报道。本文针对压力传感器与磁传感器集成一体化进行实验研究,研究结果表明本文设计的MOSFETs力/磁传感器技术方案是可行的且有广泛的应用领域。
Multi-sensor is largely used in many field for its excellet small size, light weight and power intelligent function. In this paper, the Multi-sensor made by MEMS technology has square silicon film with four parallel n type MOSFETs, which are in the stress field. The sensor has two P type equivalent channel resistances of MOSFET locate at the longitudinal orientation, and the other two locate at the transverse orientation. They make up of Wheatstone bridge.When the pressure applied, the carriers drift ratio change corresponding, two longitudinal P type equivalent channel resistances of MOSFET turn to bigger, the other two become smaller. Then there is the voltage output, which changes the pressure signal into the corresponding electric signal. Two HALL poles are placed beside the gate about scale 0.7, for single MOS Hall element, the conductive layer is the exhausted layer. When the vertical filed applied, the HALL output voltage VH is produced on the output poles. The output voltage changed as the intensity of magnetic filed changed.
     In this paper, the basic work theory of the MOSFETs pressure/magnetic sensor was discussed; the structure and the fabrication process of the MOSFETs pressure/magnetic sensor were discribled. In the experiment results, the I-V characteristic, temperature characteristic are tested. The experiment results indictate that the sensitivity of the pressure sensor is 11.5mV/100KPa, the magnetic sensitivity is 2.53mV/T; the pressure linearity is 1.36% F·S, the magnetic linearity is 0.02% F·S; the pressure lag is 0.68% F·S, the magnetic lag is 5.06% F·S; the pressure repeatability is 1.31% F·S, the magnetic repeatability is 1.48% F·S; the pressure precision is 3.5%F·S, the magetic precision is 1.8%F·S. The MOSFETs pressure/magnetic sensor meets the design demand.
     There is rarely report about the pressure/magnetic Multi-sensor abroad and internal. In this paper, the research of the pressure sensor and magnetic sensor intergrating is very meaningful in the field of the intergrating of sensors.
引文
[1]韩诗清.浅谈传感器的应用及发展.郧阳师范高等专科学校学报,2005,25(3),49
    [2]王祁,赵以宝,谢声斌.多功能传感器.传感器技术,1999,18(1):54
    [3]杨锦尊.新型传感器的应用及发展方向.现代电子技术,2006,20(235):17-18
    [4]李炳乾,朱长纯,刘君华.集成智能传感器的新进展.半导体杂志,1999,24(2):11-12
    [5]周再发,秦明,张中平,黄庆安.智能集成传感器系统的研究进展.微电子学,2003,33(5):431
    [6]吕惠民,田敬民著.压力传感器的研究现状与发展趋势[J].半导体技术.1998,23(2):11-14.
    [7] Bryzek J.Impact of MEMS technology on society[J].Sensors and Actuators.1996,56:1-9.
    [8]赵晓峰,温殿忠.MEMS研究与发展前景[J].黑龙江大学自然科学学报.2002,19(1):64-69.
    [9]王涓,孙岳明.单晶硅各向异性湿法腐蚀机理的研究进展[J].化工时刊.2004,18(6):1-5.
    [10]王清平,郭林等.1μm宽硅深槽刻蚀技术[J].微电子学.1996:5-39.
    [11] Dianzhong Wen.Study on Ar-ion laser enhanced anisotropic etching rate of Si[J].Chinese Journal of Laser.1995: 202-204.
    [12] V.D.Samper,A.J.Sangster,U.Wallrabe,et al.Multistator LIGA-fabricated electrostatic wobble motors with integrated syn-chronous control[J].IEEE J. Microelectromech. Syst.1998,7(2):214-223.
    [13] V.D.Samper,A.J.Sangster,U.Wallrabe,et al.Advanced LIGA technology for the Integration of an electrostatically controlled bearing in a wobblemicromotor[J].Journal of Microelectromechanical Systems.1998,7(4):423-427.
    [14] T. Ishihara, K. Suzuki, S. Suwazono, M. Hirata, H. Tanigawa.CMOS integrated silicon pressure sensor[J].Solid-State Circuits.1987,22 (2):151–156
    [15] W. Riethmuller, W. Benecke, U. Schnakenberg, B. Wagner, A smart.Accelerometer with on-chip electronics fabricated by a commercial CMOS process[J]. Sens. Actuators A .1992,31 (1–3):121–124.
    [16] F. Gretillat, M.A. Gretillat, N.F. de Rooij. Improved design of a silicon micromachined gyroscope with piezoresistive detection and electromagnetic excitation[J].Microelectromech. Syst.1999,8 (3):243–250.
    [17] A. Kooser, R.L. Gunter, W.D. Delinger, T.L. Porter, M.P. Eastman. Gas sensing using embedded piezoresistive microcantilever sensors[J] . Sens. Actuators B.2004,99 (2–3):474–479.
    [18] Desnical UV, Santic B. Trap-induced photoconductivity in semi-insulating gallium arsenide. Sesors and Actuators. 1989, 21(5), 76~79
    [19] H. Mikoshiba . Stress-sensitive properties of silicon-gale MOS devices[J].Solid-State Electron.1981,24:221-232.
    [20] Z.Z. Wang, J. Sushi and D. Collard . Piezoresistive simulation in MOSFETs. Sensors and Actuators A.1993,37-38:357-364.
    [21] Terunobu Akiyama a, Andreas Tonin, Hans-Rudolf Hidber.Characterization of an integrated force. sensor based on a MOS transistor for applications in scanning force microscopy.Sensors and Actuators A.1998,64:1-6
    [22] Vitor Garcia, Fabiano Fruett. A mechanical-stress sensitive differential amplifier. Sensors and Actuators A 132 (2006) 8–13.
    [23]颜黄苹,冯勇建,许金海. MOS场效应管压力微传感器[J].传感器技术,2001,20(5):19~21
    [24]岳瑞峰,刘理天,李志坚.集成MOS力敏运放压力传感器[J].半导体学报,2001,22(4):500~502
    [25] E. Hynes, M. O’Neill, D. McAuliffe. Development and characterization of asurface micromachined FET pressure sensor on a CMOS process[J]. Sensors and Actuators. 1999,76:283–292
    [26]张晓群,吕惠民.压力传感器的发展、现状与未来[J].半导体杂志, 2000, 25(1): 47-50.
    [27]梁秀红,鞠玉林,任丙彦.扩散硅压阻传感技术的研究现状与发展趋势[J].河北工业大学成人教育学院学报, 2000, 15(2): 37-51.
    [28]张海涛.霍尔效应及应用.温州职业技术学院学报. 2005,5(4):26-28
    [29] R.S.Popovic,J.A.Flanagan,P.A.Besse.The future of magnetic sensors.Sensor and Actuators.1996,56:39-55
    [30] B.Dieny et al., Magnetotransport properties of magnetically soft spinvalve structures, J.Magn.Mater, 1991, 94:L1-L5
    [31] P.Ripka.Magnetic sensors for industrial and field applications.Sensor and Actuators A.1994 (41-42):394-397
    [32] K. Mohria, T. Uchiyama, L.P. Shena, C.M. Caia, L.V. Paninab. Amorphous wire and CMOS IC-based sensitivemicro-magnetic sensors (MI sensor and SI sensor) for intelligent measurements and controls. Journal of Magnetism and Magnetic Materials. 2002, 249:351–356
    [33] R.C. Gallagher and W.S. Corak. MOS Hall Element and It’s Use. Solid-State Electron, 1966, 9, p571
    [34] FengNing, Erik Bruun. An offset-trimmable array of magnetic-field-sensitive MOS transistors. Sensors and Actuators A 58, (1997), 109-112
    [35] H. Blanchard, F. De Montmollin, J. Hubin. Highly sensitive Hall sensor in CMOS technology. Sensors and Actuators 82(2000)144–148
    [36]程姝丹,张强.霍尔效应的应用与发展.电气自动化,2007,4(78):78-82
    [37] Popovic R S, et al. The future of magnetic sensors. Sensors and Actuators, 1996, A56 (1~2):39~55
    [38] Opovic R S, et al. Integrated Hall-effect magnetic sensors. Sensors and Actuators,2001,A91:46~50
    [39]孙金玮,翟彬,李德胜.一种温湿度、照度多功能传感器的研究.仪器仪表学报.2001,22(4):79-80
    [40] Yoshii Y, Nakajo A, Abe H et al. Chip integrated software calibrated CMOS pressure sensor with MCU,A/D converter, D/A converter, digital communication port, signal conditioning circuit and temperature sensor[A]. Sensors and Actuators [C]. Chicago, USA. 1997. 1485-1488.
    [41] Diem B, Rey P, Renard S, et al. Sensors and Actuators (A),1995,46-47:8~16
    [42] Wise KD. Integrated Microsystems merging MEMS, micro power electronics and wireless communications [A]. 12th ASIC/SOC Conf [C]. 1999. xxiii-xxix.
    [43] Shimoyama Akihiko, Shida Katsunori. A Thermister Having Mul-function for Measuring Temperature and the Velocity of Wind The 13th SICE Symposium,Kyushou,Japan.1994.319~320
    [44]张文栋,石云波.新型复合硅微传感器的设计[J].纳米技术与精密工,2004,2(1):24~28
    [45] Yong Xua, Chen-Wei Chiu, Fukang Jiang. A MEMS multi-sensor chip for gas flow sensing. Sensors and Actuators A 121 (2005) 253–261
    [46]杨大丽.传感器技术的应用与发展趋势分析. SCIENCE & TECHNOLOGY INFORMATION. 2007, 24:362-366
    [47]王惠.新型传感器的现状与发展.机械管理开发.2007,5:34-35
    [48] R. Sunier, S. Taschini, O. Brand, T. Vancura, H. Baltes, Quasi-analytical study of offset voltage due to piezoresistive effect in vertical Hall devices by mapping techniques, in: Proceedings of Transducers Conference, June 8–12, Boston, USA, 2003.
    [49] J. Bartholomeyczik, S. Brugger, P. Ruther, O. Paul, Multidimensional CMOS in-plane stress sensor, IEEE Sensors J. 5 (5) (2005) 872–882.
    [50] M. Doelle, P. Ruther, O. Paul, A novel stress sensor based on the transverse pseudo-hall effect of MOSFETs, in: Proceedings of IEEE MEMS Conference, January 19–23, Kyoto, Japan, 2003.
    [51] M. Doelle, C. Peters, P. Gieschke, P. Ruther, O. Paul, Two-dimensional high density piezo-FET stress sensor arrays for the in-situ monitoring of wire bonding, in:Processes, Tech. Digest, IEEE MEMS Conference. January 25–29, Maastricht, The Netherlands, 2004.
    [52] M. Doelle, J. Bartholomeyczik, P. Ruther, O. Paul, Novel highly miniaturized multi-stress sensor based on eight-terminal field effect transistor, in: Proceedings of Transducers Conference, June 5–9, Seoul, Korea, 2005.
    [53] J.-P. Raskin, F. Iker, N. Andr, et al. Bulk and surface micromachined MEMS in thin film SOI technology[J]. Sens. Actuators A. 2007, 52: 2850~2861.
    [54]温殿忠.力学量敏感器件原理与应用[M].哈尔滨:黑龙江科学技术出版社. 1994: 1-218.
    [55]孙以材,刘玉岭.压力传感器的设计、制造与应用[M].冶金工业出版社.2000,310-320.
    [56] V.A. Gridchin, R.A. Pirogova.Numerical simulation of multiterminal silicon piezoelement[J].Sensors and Actuators A.1998,65:5-9.
    [57] Eric Perraud.Theoretical model of performance of a silicon piezoresistive pressure sensor[J].Sensors and Actuators A.1996,57:245-252.
    [58] Jiang Zhuangde, Wang Xiaobin.Micro mechanic Sensor[J] .Proceedings JSMEJMIPE,Tokyo,1996:779-782.
    [59]刘恩科,朱秉升,罗晋生等.半导体物理[M].国防工业出版社.1989,323-330.
    [60]温殿忠.磁敏感元器件与磁传感器[M].哈尔滨:黑龙江科学技术出版社. 2002: 7-20.
    [61] Gajendra Shekhawat, Soo-Hyun Tark, Vinayak P.Dravid. MOSFET-Embedded Microcantilevers for Measuring Deflection in Biomolecular Sensor. SCIENCE. 2006, 311:1592-1595.
    [62]孙慧明,于泉.半导体敏感元器件工艺原理[M].哈尔滨:东北林业大学出版社. 2000. 145-192.
    [63]王胜强,刘玉奎,黄磊.LPCVD多晶硅薄膜缺陷的形成及消除措施[J].微电子学.2006,46(4):484-487
    [64]郑志霞等.ICP刻蚀技术研究[J].厦门大学学报.2004, 43:366-368.
    [65] Paul A K, Rangelow I W. Fabrication of high aspect ratio structures using chlorine gas chopping technique [J].Microelectronic Engineering,1997,35:79-82.

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