无铅热风回流炉温度控制系统的设计与研究
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摘要
热风无铅回流炉是表面贴装技术(SMT)中应用较广的表面贴装元器件的焊接设备之一。随着电子元器件的微型化、智能化、集成化以及表面贴装技术的发展,热风无铅回流炉的应用日益广泛。在热风回流炉的温度控制过程中,温度控制的精度和横向温差是保证良好工艺的关键。
本课题研究的目的在于为减少横向温差提供理论依据,并研究回流炉温度控制系统的PID整定,提高现有回流炉温度控制系统的响应速度。本文通过CFD理论分析了加热模块内的温度场分布,通过实验研究了如何整定PID参数,本文所做主要研究工作如下:
(1)分析了热风无铅回流炉的加热特点,从理论上阐述了对流换热传热的基本原理,并通过流体动力学的理论求得了对流换热系数的分布情况,从而解决了横向温差问题,并提出了解决横向温差的结构。
(2)研究了通过回流炉温度控制模块后PCB板的温度变化曲线。分析了PCB板实际温度曲线的变化情况,通过有限元分析软件ANSYS对回流炉内的PCB板进行温度仿真分析,获得了与实际温度曲线相吻合的仿真曲线;编制了回流炉专用的系统分析软件。
(3)研究了回流炉温度闭环控制系统的PID参数的设计。通过系统实际实验,分别整定了比例系数、积分时间常数、微分时间常数等三个参数,获得了较快的回流炉温度控制系响应。
本文分析了回流炉的温度控制系统的特点,为如何改进加热模块提供了理论依据;研究了通过回流炉后的PCB板温度曲线,为预测PCB板的温度曲线提供了理论依据;PID参数的设计的研究对回流炉温度控制系统的改进具有一定的参考价值。
The hot-air lead-free reflow oven is one of soldering devices which are widely applied in surface mounted technology. As electronic components become microminiaturization, intelligent and integrated, hot-air lead-free reflow oven will be applied more generally. In the temperature controlled process,control precisions of the temperature and horizontal temperature difference are important in keeping good soldering process.
In this thesis, theoretical basis for reducing horizontal temperature difference is provided. The efficient setting methods of the PID parameters are researched. The current reflow oven's response time is improved. In this thesis, temperature field in heating module is analyzed with CAE simulation. PID parameters are regulated by experiments. The main work is included as follows:
(1) Heating character of reflow oven is introduced. The basic principles of convection heat transfer are analyzed. Then heat coefficient distribution is obtained by fluid dynamic theory. Horizontal temperature difference is explained. At last the redesign scheme of structure for solving temperature difference is proposed and completed.
(2) The temperature profile of PCB after passing reflow oven is obtained. Practical temperature profile of PCB board is analyzed. By using FEA software ANSYS, temperature profile of PCB board is simulated. The simulated profile is matched very well with practical one. The special software for system analysis is completed.
(3) The design of PID parameters of close-loop control system of reflow oven is given. Proportional coefficient, integral time constant and derivative time constant are regulated respectively by lots of experiments. The method of quickly regulating PID parameters is obtained.
The conclusions in this thesis drawn from experiments and simulations indicate the characters of reflow oven’s control system. They are important theoretical basis for improving heating module. Practical temperature profile of PCB board after passing reflow oven is important theoretical basis for predicting temperature profile of PCB board. The tuning method of PID parameters is of valuable worth for improving reflow oven’s temperature control system.
本课题研究的目的在于为减少横向温差提供理论依据,并研究回流炉温度控制系统的PID整定,提高现有回流炉温度控制系统的响应速度。本文通过CFD理论分析了加热模块内的温度场分布,通过实验研究了如何整定PID参数,本文所做主要研究工作如下:
(1)分析了热风无铅回流炉的加热特点,从理论上阐述了对流换热传热的基本原理,并通过流体动力学的理论求得了对流换热系数的分布情况,从而解决了横向温差问题,并提出了解决横向温差的结构。
(2)研究了通过回流炉温度控制模块后PCB板的温度变化曲线。分析了PCB板实际温度曲线的变化情况,通过有限元分析软件ANSYS对回流炉内的PCB板进行温度仿真分析,获得了与实际温度曲线相吻合的仿真曲线;编制了回流炉专用的系统分析软件。
(3)研究了回流炉温度闭环控制系统的PID参数的设计。通过系统实际实验,分别整定了比例系数、积分时间常数、微分时间常数等三个参数,获得了较快的回流炉温度控制系响应。
本文分析了回流炉的温度控制系统的特点,为如何改进加热模块提供了理论依据;研究了通过回流炉后的PCB板温度曲线,为预测PCB板的温度曲线提供了理论依据;PID参数的设计的研究对回流炉温度控制系统的改进具有一定的参考价值。
The hot-air lead-free reflow oven is one of soldering devices which are widely applied in surface mounted technology. As electronic components become microminiaturization, intelligent and integrated, hot-air lead-free reflow oven will be applied more generally. In the temperature controlled process,control precisions of the temperature and horizontal temperature difference are important in keeping good soldering process.
In this thesis, theoretical basis for reducing horizontal temperature difference is provided. The efficient setting methods of the PID parameters are researched. The current reflow oven's response time is improved. In this thesis, temperature field in heating module is analyzed with CAE simulation. PID parameters are regulated by experiments. The main work is included as follows:
(1) Heating character of reflow oven is introduced. The basic principles of convection heat transfer are analyzed. Then heat coefficient distribution is obtained by fluid dynamic theory. Horizontal temperature difference is explained. At last the redesign scheme of structure for solving temperature difference is proposed and completed.
(2) The temperature profile of PCB after passing reflow oven is obtained. Practical temperature profile of PCB board is analyzed. By using FEA software ANSYS, temperature profile of PCB board is simulated. The simulated profile is matched very well with practical one. The special software for system analysis is completed.
(3) The design of PID parameters of close-loop control system of reflow oven is given. Proportional coefficient, integral time constant and derivative time constant are regulated respectively by lots of experiments. The method of quickly regulating PID parameters is obtained.
The conclusions in this thesis drawn from experiments and simulations indicate the characters of reflow oven’s control system. They are important theoretical basis for improving heating module. Practical temperature profile of PCB board after passing reflow oven is important theoretical basis for predicting temperature profile of PCB board. The tuning method of PID parameters is of valuable worth for improving reflow oven’s temperature control system.
引文
1张国锋.七区回流焊在无铅工艺中的应用.电子元器件应用. 2007,6:58~59
2 Motohiro Yamane, Nobuaki Orita, Koichi Miyazaki, Weiming Zhou. Development of New Model Reflow Oven for Lead-Free Soldering. Furukawa Review. 2004, 26:31~36
3 Kosuke Nakao, Atsushi Hiraizumi, Etsuko Iwasaki. Reflow Oven for a Pb-Free Soldering Process. Furukawa Review. 2001, 20:77~82
4王润富,陈国荣.温度场和温度应力.科学出版社. 2006, 3:1
5潘开林,周德俭. SMT再流焊接工艺预测与仿真技术研究现状.电子工艺技术. 2000,21(5):185~187
6 Sarvar F. A process modeling system for reflow of surface mount assemblies. LUT Tech Rep Version 2.1. 1995, (7):18
7 Farhad Sarvar, Paul P Conwy. A modeling tool for the thermal optimization of the reflow soldering of printed circuit assemblies. FINITE ELEM ANAL DES. 1998, 30(1-2):47~63
8 Sarvar F. Effective transient process modeling of the reflow soldering of printed circuit assemblies. Proc IEEE ASME I-THERMV Conf, Orlando, FL. 1996:195~202
9 Sarvar F. Effective modeling of the reflow soldering process: basis, construction and operation of process model. IEEE trans on component, packaging, and manufacturing technology-part c. 1998, 21(2):126~133
10 Dudi Amir. Establishing control of the solder reflow process. Electronic packaging&production. 1998, (6):84~90
11 Simon J Arbib. Forecasting the reflow soldering process. Electronic packaging & production. 1999, (2):93~96
12黄丙元,韩国明,樊强,毛信龙. SMT再流焊工艺及其仿真研究现状.电子工艺技术. 2004, 11:234~235
13杜磊,孙承永.再流焊工艺中表面组装片式元件热传输特性模拟.电子元件与材料. 1995, 14(1):13~19
14黄丙元,孙桂珍,张同岭. SMT温度场的数学模型.电子工艺技术. 2005, 11:333~335
15王涛,吴小钰,曾红专,韩丽屏.基于BP神经网络的PID控制器在渠道自动控制中的应用.水利学报. 2004, 11:1
16曹敏.回流焊机的数字PID控制研究.电子工艺技术. 1997, 5:45
17宋安军,曹捷,张国琦.用模糊PID算法实现热风回流焊机计算机控制.电子工艺技术. 2000, 5:110~112
18赵鹏程,王致杰,王耀才,李冬.基于神经模糊的工业锅炉温度控制器的研究.煤矿机械. 2003, 5:16~17
19 Kangling Fang, Zhongjie Shen. A neural-Fuzzy Control In Resistance Furnance. IEEE,Intelligent Processing Systems. 1997:200-204
20顾霭云. SMT回流焊接质量分析.世界产品与技术. 2002,2:66~69
21曹白杨,赵小青,梁万雷.回流焊温度曲线热容研究.华北航空工业学院学报. 2005,8:6~9
22徐波,王乐,史建卫,钱乙余.无铅回流焊冷却速率研究应用现状.电子工业专用设备. 2005,12:34~35
23杨世铭,陶文铨.传热学. 2006, 8:4
24王富耻,张朝晖. ANSYS10.0有限元分析理论与工程应用. 2006, 5:1
25 Zhou Jie-min, Fu Yi-feng, Tu Yuan, Yang Ying, Chen Xiao-ling. Study on Compulsive Cooling of Straight Impinging Jet Array and Swirling Jet Imingement. 2006, 6:34~40
26 Michinobu Inoue and Takashi Koyanagawa Corporate Manufacturing Engineer Center. IEEE Electronic Components and Technology Conference. 2005:1021~1026
27 SHEN Liang, Wang Mingxiang, HE YongHong, LAM Tim Fai, Jiang YuQi. A Comprehensive Finite Element Model for Simulating Reflow Profile of a BGA Package. IEEE Proceedings of HDP’06. 2006, 6:1583~1588
28 Paul Svasta, Daniel Simion-Zanescu, Ciszkowski Willi. Thermal Conductivity Influence in SMT Reflow Soldering Process. IEEE 2002 Electronic Components and Technology Conference. 2002, 2:1613~1616
29 YubingGong, QuanyongLi, D.G.Yang. The Optimization of Reflow Soldering Temperature Profile Based on Simulation. IEEE. 2006 7th International Conference on Electronics Packaging Technology. 2006, 6:1432~1437
30 Balázs Illés, Olivér Krammer, Gábor Harsányi, Zsolt Illyefalvi-Vitéz. Modelling Heat Transfer Efficiency in Forced Convection Reflow Ovens. IEEE, ISSE 2006 St. Marienthal, Germany. 2006, 6:80:85
31 A.R. Ochana, D.A. Hutt, D.C. Whalley, F.Sarvar, A.Al-Habaibeh. Modeling of the Power Cycling Performance of a Si on Si Flip Chip Assembly. 2006, 6:243~250
32 FarhadSarvar, PaulP.Conway. Effective Modeling of the Re?ow Soldering Process: Use of a Modeling Tool for Product and Process Design. IEEE Transactions on components, packaging, and manufacturing technology. 1998, 7(21):165~171
33 Y.S.Son, T.L.Bergman, G.Y.Masada. Detailed card assembly thermal response during infrared re?ow soldering. ASMEAdv Electronic Package. 1993:575~581
34 Y.S.Son, T.L.Bergman, M.T.Hyun. Simulation of heat transfer in a re?ow soldering oven with air and nitrogen injection. ASME J. Electron. Package 1995, 12:317~322
35 S.H.Mannan, N.N.Ekere, I.Ismail, E.K.Lo. Squeegee deformation study in the stencil printing of solder pastes. IEEE Transient Components, Package, Manufacture Technology. 1994, 9:470:476
36 Motohiro Yamane, Nobuaki Orita, Koichi Miyazaki, Weiming Zhou. Development of New Model Reflow Oven for Lead-Free Soldering. Furukawa Review. 2004:31~36
37 Paul Svasta, Daniel Simion-Zanescu, Rocsana Ionescu. Components’Emisivity in Reflow Soldering Process. IEEE 2004 Electronic Components and Technology Conference. 2004, 4:1921~1924
38 Nele Van Steenberge, Bart Vandevelde, Inge Schildermans, Geert Willems. Analytical and Finite Element Models of the Thermal Behavior for Lead-free Soldering Processes in Electronic Assembly. IEEE 6th. Int. Conf. on Thermal, Mechanical and mutiphysics Simulation and Experiments in Micro-Electronics and Micro-System, EuroSimE 2005. 2005, 5:675~680
39 D. J. Xie, Y. C. Chan, J. K. L. Lai. An Experimental Approach to Pore-Free Reflow Soldering. IEEE transactions on components, packaging, and manufacturing technology. 1996, 2:148~153
40 Wu Zhao-hua. A Study on Statistical Process Control Technology Applied in Reflow Soldering Processes. IEEE. 2005 6th International Conference on Electronic Packaging Technology. 2005, 5:1452~1457
41 Xiao-nan Peng, Zhao-hua Wu. Application strategies of SPC technology applied in SMT manufacturing. Modern Surface Mounting Technology Information. 2003, 4:40~43
42 D.C.Whalley. A simplified reflow soldering process model. Journal of Material Processing Technology. 2004 :134~144
2 Motohiro Yamane, Nobuaki Orita, Koichi Miyazaki, Weiming Zhou. Development of New Model Reflow Oven for Lead-Free Soldering. Furukawa Review. 2004, 26:31~36
3 Kosuke Nakao, Atsushi Hiraizumi, Etsuko Iwasaki. Reflow Oven for a Pb-Free Soldering Process. Furukawa Review. 2001, 20:77~82
4王润富,陈国荣.温度场和温度应力.科学出版社. 2006, 3:1
5潘开林,周德俭. SMT再流焊接工艺预测与仿真技术研究现状.电子工艺技术. 2000,21(5):185~187
6 Sarvar F. A process modeling system for reflow of surface mount assemblies. LUT Tech Rep Version 2.1. 1995, (7):18
7 Farhad Sarvar, Paul P Conwy. A modeling tool for the thermal optimization of the reflow soldering of printed circuit assemblies. FINITE ELEM ANAL DES. 1998, 30(1-2):47~63
8 Sarvar F. Effective transient process modeling of the reflow soldering of printed circuit assemblies. Proc IEEE ASME I-THERMV Conf, Orlando, FL. 1996:195~202
9 Sarvar F. Effective modeling of the reflow soldering process: basis, construction and operation of process model. IEEE trans on component, packaging, and manufacturing technology-part c. 1998, 21(2):126~133
10 Dudi Amir. Establishing control of the solder reflow process. Electronic packaging&production. 1998, (6):84~90
11 Simon J Arbib. Forecasting the reflow soldering process. Electronic packaging & production. 1999, (2):93~96
12黄丙元,韩国明,樊强,毛信龙. SMT再流焊工艺及其仿真研究现状.电子工艺技术. 2004, 11:234~235
13杜磊,孙承永.再流焊工艺中表面组装片式元件热传输特性模拟.电子元件与材料. 1995, 14(1):13~19
14黄丙元,孙桂珍,张同岭. SMT温度场的数学模型.电子工艺技术. 2005, 11:333~335
15王涛,吴小钰,曾红专,韩丽屏.基于BP神经网络的PID控制器在渠道自动控制中的应用.水利学报. 2004, 11:1
16曹敏.回流焊机的数字PID控制研究.电子工艺技术. 1997, 5:45
17宋安军,曹捷,张国琦.用模糊PID算法实现热风回流焊机计算机控制.电子工艺技术. 2000, 5:110~112
18赵鹏程,王致杰,王耀才,李冬.基于神经模糊的工业锅炉温度控制器的研究.煤矿机械. 2003, 5:16~17
19 Kangling Fang, Zhongjie Shen. A neural-Fuzzy Control In Resistance Furnance. IEEE,Intelligent Processing Systems. 1997:200-204
20顾霭云. SMT回流焊接质量分析.世界产品与技术. 2002,2:66~69
21曹白杨,赵小青,梁万雷.回流焊温度曲线热容研究.华北航空工业学院学报. 2005,8:6~9
22徐波,王乐,史建卫,钱乙余.无铅回流焊冷却速率研究应用现状.电子工业专用设备. 2005,12:34~35
23杨世铭,陶文铨.传热学. 2006, 8:4
24王富耻,张朝晖. ANSYS10.0有限元分析理论与工程应用. 2006, 5:1
25 Zhou Jie-min, Fu Yi-feng, Tu Yuan, Yang Ying, Chen Xiao-ling. Study on Compulsive Cooling of Straight Impinging Jet Array and Swirling Jet Imingement. 2006, 6:34~40
26 Michinobu Inoue and Takashi Koyanagawa Corporate Manufacturing Engineer Center. IEEE Electronic Components and Technology Conference. 2005:1021~1026
27 SHEN Liang, Wang Mingxiang, HE YongHong, LAM Tim Fai, Jiang YuQi. A Comprehensive Finite Element Model for Simulating Reflow Profile of a BGA Package. IEEE Proceedings of HDP’06. 2006, 6:1583~1588
28 Paul Svasta, Daniel Simion-Zanescu, Ciszkowski Willi. Thermal Conductivity Influence in SMT Reflow Soldering Process. IEEE 2002 Electronic Components and Technology Conference. 2002, 2:1613~1616
29 YubingGong, QuanyongLi, D.G.Yang. The Optimization of Reflow Soldering Temperature Profile Based on Simulation. IEEE. 2006 7th International Conference on Electronics Packaging Technology. 2006, 6:1432~1437
30 Balázs Illés, Olivér Krammer, Gábor Harsányi, Zsolt Illyefalvi-Vitéz. Modelling Heat Transfer Efficiency in Forced Convection Reflow Ovens. IEEE, ISSE 2006 St. Marienthal, Germany. 2006, 6:80:85
31 A.R. Ochana, D.A. Hutt, D.C. Whalley, F.Sarvar, A.Al-Habaibeh. Modeling of the Power Cycling Performance of a Si on Si Flip Chip Assembly. 2006, 6:243~250
32 FarhadSarvar, PaulP.Conway. Effective Modeling of the Re?ow Soldering Process: Use of a Modeling Tool for Product and Process Design. IEEE Transactions on components, packaging, and manufacturing technology. 1998, 7(21):165~171
33 Y.S.Son, T.L.Bergman, G.Y.Masada. Detailed card assembly thermal response during infrared re?ow soldering. ASMEAdv Electronic Package. 1993:575~581
34 Y.S.Son, T.L.Bergman, M.T.Hyun. Simulation of heat transfer in a re?ow soldering oven with air and nitrogen injection. ASME J. Electron. Package 1995, 12:317~322
35 S.H.Mannan, N.N.Ekere, I.Ismail, E.K.Lo. Squeegee deformation study in the stencil printing of solder pastes. IEEE Transient Components, Package, Manufacture Technology. 1994, 9:470:476
36 Motohiro Yamane, Nobuaki Orita, Koichi Miyazaki, Weiming Zhou. Development of New Model Reflow Oven for Lead-Free Soldering. Furukawa Review. 2004:31~36
37 Paul Svasta, Daniel Simion-Zanescu, Rocsana Ionescu. Components’Emisivity in Reflow Soldering Process. IEEE 2004 Electronic Components and Technology Conference. 2004, 4:1921~1924
38 Nele Van Steenberge, Bart Vandevelde, Inge Schildermans, Geert Willems. Analytical and Finite Element Models of the Thermal Behavior for Lead-free Soldering Processes in Electronic Assembly. IEEE 6th. Int. Conf. on Thermal, Mechanical and mutiphysics Simulation and Experiments in Micro-Electronics and Micro-System, EuroSimE 2005. 2005, 5:675~680
39 D. J. Xie, Y. C. Chan, J. K. L. Lai. An Experimental Approach to Pore-Free Reflow Soldering. IEEE transactions on components, packaging, and manufacturing technology. 1996, 2:148~153
40 Wu Zhao-hua. A Study on Statistical Process Control Technology Applied in Reflow Soldering Processes. IEEE. 2005 6th International Conference on Electronic Packaging Technology. 2005, 5:1452~1457
41 Xiao-nan Peng, Zhao-hua Wu. Application strategies of SPC technology applied in SMT manufacturing. Modern Surface Mounting Technology Information. 2003, 4:40~43
42 D.C.Whalley. A simplified reflow soldering process model. Journal of Material Processing Technology. 2004 :134~144