Correlation between interfacial microstructure and bonding strength of sintered nanosilver on ENIG and electroplated Ni/Au direct-bond-copper (DBC) substrates
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- 作者：Qianye Xua ; b ; Yunhui Meia ; b ; yunhui@tju.edu.cn" class="auth_mail" title="E-mail the corresponding author ; Xin Lia ; b ; Guo-Quan Lua ; c
- 关键词：Nanosilver paste ; ENIG ; Electroplated Ni/Au ; Interfacial reaction ; Microstructures
- 刊名：Journal of Alloys and Compounds
- 出版年：2016
- 出版时间：5 August 2016
- 年：2016
- 卷：675
- 期：Complete
- 页码：317-324
- 全文大小：2481 K
文摘
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Nanosilver paste was used to connect dies and substrates with ENIG and Ni/Au finishes.
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A solid solution layer and a delamination region generated in ENIG joint but not in Ni/Au joint.
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The ENIG joint exhibits higher diffusion coefficients than the Ni/Au joint.
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A modified sintering process can effectively suppress the formation of the delamination region in ENIG joint.
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