Comparative study of the lubricating behavior between 12-in. copper disk and wafer during chemical mechanical polishing
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- 作者：Dewen Zhao ; Yongyong He ; Tongqing Wang ; Xinchun Lu ; xclu@tsinghua.edu.cn" class="auth_mail" title="E-mail the corresponding author
- 关键词：Chemical mechanical polishing ; Hydrodynamic lubrication ; Carrier structure ; Fluid pressure
- 刊名：Tribology International
- 出版年：2017
- 出版时间：January 2017
- 年：2017
- 卷：105
- 期：Complete
- 页码：37-41
- 全文大小：875 K
文摘
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A special copper disk carrier was developed to do comparative studies for CMP.
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The fluid pressure and pitch angle were compared between the disk and wafer.
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The disk leans down toward the leading edge and forms negative fluid pressure.
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Different balancing statuses and wedged gaps are formed for the two structures.
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The results of the disk agree with other studies.
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