Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn-0.7Cu solder for high temperature packaging application

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• 作者：Hongjun Ji ; ^{jhj7005@hit.edu.cn" class="auth_mail" title="E-mail the corresponding author} ; Yunfei Qiao ; Mingyu Li ; ^{myli@hit.edu.cn" class="auth_mail" title="E-mail the corresponding author}
• 关键词：Ultrasonic-assisted soldering ; Die bonding ; Microstructure ; Intermetallic joint ; Thermal conductivity
• 刊名：Scripta Materialia
• 出版年：2016
• 出版时间：1 January 2016
• 年：2016
• 卷：110
• 期：Complete
• 页码：19-23
• 全文大小：1239 K

文摘

Rapid formation of complete intermetallic-phases (IPs)-composed joints during die bonding for high temperature applications was achieved by pressureless and fluxless ultrasonic-assisted soldering in air within seconds. The joint consisted of sole (Cu,Ni)₆Sn₅ plus a thin layer of Cu₃Sn possessed a rather low thermal resistance of 0.252 mm² K W⁻¹ and a high shear strength of 69 MPa. This rapid formation of fully IPs-composed structures was probably accelerated by ultrasonic cavitation and streaming effects through supersaturation of copper in the melted solder. Compared with transient-liquid-phase soldering, this method dramatically reduces the processing time and there was no external force acted on the dies.