MicroPen direct-write deposition of polyimide

详细信息    查看全文

• 作者：Yu Cao ; Liangwen Zhou ; Xiaoye Wang ; Xiangyou Li ; Xiaoyan Zeng
• 关键词：MicroPen ; Direct-write ; Polyimide ; Paste ; MEMS
• 刊名：Microelectronic Engineering
• 出版年：2009
• 出版时间：October 2009
• 年：2009
• 卷：86
• 期：10
• 页码：1989-1993
• 全文大小：469 K

文摘

Polyimide has been widely used as structural or sacrificial material in MEMS device fabrication. However, all the typical methods for processing polyimide are based on lithographic technique, which are time-consuming, expensive and non-flexible. In this paper, we propose a novel approach for depositing polyimide patterns by the microPen direct-write deposition technique, which is CAD direct-driven, maskless, rapid-prototyping, and diverse materials integration. Material and device for the microPen direct-write deposition of polyimide technique are presented in detail, and the influences of direct-writing parameters, such as extrusive gas–pressure, direct-writing velocity and the tip-to-substrate distance, on the profile of the deposited polyimide pattern are discussed. Using commercial gold paste (Au) as the structural layer material and polyimide as the sacrificial layer, a micro air-bridge array is successfully fabricated by the microPen direct-write deposition technique, which shows its potential applications in the area of MEMS device fabrication.