Effects of grinding parameters on surface quality in silicon nitride grinding

详细信息    查看全文

• 作者：Wei Liu ; ^{lw1986tiger@163.com" class="auth_mail" title="E-mail the corresponding author} ; Zhaohui Deng ; Yuanyuan Shang ; Linlin Wan
• 关键词：Silicon nitride ; Grinding ; Orthogonal experiment ; Surface quality
• 刊名：Ceramics International
• 出版年：2017
• 出版时间：January 2017
• 年：2017
• 卷：43
• 期：1
• 页码：1571-1577
• 全文大小：1962 K

文摘

To reveal the effects of the grinding parameters on the ground surface quality of silicon nitride grinding to guide processing for improving the processing accuracy and productivity, orthogonal experiments on silicon nitride grinding are carried out by a diamond grinding wheel, and the effects are studied systematically. The influences of the grinding parameters, such as the grain size, wheel speed, workpiece speed and grinding depth, are analysed regarding their effects on the grinding force, surface morphology, surface roughness and subsurface damage. The undeformed chip thickness and equivalent chip thickness are also studied to provide a comprehensive analysis of the ground surface quality. The quality and effectiveness of silicon nitride grinding can be improved by optimizing the grinding parameters according to this study.