Interplay between bond breaking and plasticity during fracture at a nanomolecularly-modified metal-ceramic interface

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• 作者：Matthew Kwan^a ; Muriel Braccini^a ; ^b ; Ashutosh Jain^a ; Michael W. Lane^c ; Ganpati Ramanath^a ; ^{Ramanath@rpi.edu" class="auth_mail" title="E-mail the corresponding author}
• 关键词：Fracture ; Plasticity ; Interfaces ; Self-assembly ; Organosilane
• 刊名：Scripta Materialia
• 出版年：2016
• 出版时间：August 2016
• 年：2016
• 卷：121
• 期：Complete
• 页码：42-44
• 全文大小：481 K

文摘

We reveal the roles of moisture and temperature on the interplay between interfacial work of adhesion γ_a and metal plasticity γ_p for copper-silica interfaces modified with an organosilane nanolayer. We find that γ_p ≠ 0 for interfaces with metal thicknesses h_Cu > 12 nm, and increases with h_Cu before it saturates at h_Cu ~ 165 nm. For a fixed h_Cu, γ_p increases due to temperature-induced yield stress decrease despite a decrease in γ_a with temperature because of water-induced siloxane bond weakening. These findings should be valuable for understanding the fracture mechanics of, and designing, nanomolecularly-functionalized interfaces subject to thermomechanical and chemical stresses.