Thermal curing and degradation mechanism of polyhedral oligomeric octa(propargylaminophenyl)silsesquioxane

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• 作者：Haibo Fan ; Xiangmei Li ; ^{bjlglxm@bit.edu.cn} ; Yanlin Liu ; Rongjie Yang
• 关键词：Octa(propargylaminophenyl)silsesquioxane ; Curing ; Degradation ; Mechanism
• 刊名：Polymer Degradation and Stability
• 出版年：2013
• 出版时间：January, 2013
• 年：2013
• 卷：98
• 期：1
• 页码：281-287
• 全文大小：1449 K

文摘

Polyhedral oligomeric octa(propargylaminophenyl)silsesquioxane (OPAPS) was synthesized and the pressed OPAPS thermally cured with a controlled temperature program. The OPAPS and its cured products were characterized by DSC, FT-IR, XRD, SEM and TGA. TG-MS was used to detect the decomposition products of OPAPS and its cured products with increasing temperature in an inert atmosphere. Curing of OPAPS commenced around 170?¡ãC and was completed by 250?¡ãC. The possible thermal curing mechanism of the OPAPS involved five- and six-membered rings which contained conjugated diene bonds connected with secondary amine. The thermal degradation of the OPAPS and the cured product differed: Alkyne, methyl, secondary amine and phenyl groups were seen in the OPAPS degradation products while five- or six-membered rings and phenyl groups were generated from the cured product. The thermal-oxidative degradation of the OPAPS involved three steps while only two were involved for the cured product.