High adhesion strength and hybrid irreversible/reversible full-PDMS microfluidic chips

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• 作者：Letí ; cia S. Shiroma^a ; ^b ; Aline F. Oliveira^c ; Eulicio O. Lobo-Jú ; nior^d ; Wendell K.T. Coltro^d ; Angelo L. Gobbi^a ; Lucimara G. de La Torre^c ; Renato S. Lima^a ; ^b ; ^{renato.lima@lnnano.cnpem.br}
• 关键词：Lan-on-a-chip ; Bonding ; Flow rate ; Droplets ; Emulsion ; Electrophoresis
• 刊名：Analytica Chimica Acta
• 出版年：2017
• 出版时间：25 January 2017
• 年：2017
• 卷：951
• 期：Complete
• 页码：116-123
• 全文大小：1686 K
• 卷排序：951

文摘

SWB offers simple, fast, and low cost operation requiring only a laboratory oven. Microdevices herein described showed burst pressures of up to 4.5 MPa. Reversible behavior is crucial in stages of research and development. Chips obtained after successive detachment/bonding steps withstood high pressure. Emulsifications at high flow rates produced monodisperse dispersions.