Pre-plating of Bismuth film electrode with coexisted Sn²⁺ in electrolyte

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• 作者：Dandan Kong ^{k_dandan@163.com" class="auth_mail} ; Yongmei Chen ; ^{chenym@mail.buct.edu.cn" class="auth_mail} ; Pingyu Wan ; ^{pywan@mail.buct.edu.cn" class="auth_mail} ; Shuangyan Liu ; Zia Ul Haq Khan ; Bao Men
• 关键词：Bismuth-film electrode ; Sn2+ ; Pre-plating ; Metal ion deficient layer (MIDL)
• 刊名：Electrochimica Acta
• 出版年：10 April, 2014
• 年：2014
• 卷：125
• 期：Complete
• 页码：573-579
• 全文大小：2656 K

文摘

Bismuth film electrodes (BiFEs) have extensive application in electrochemical analysis, while the sensitivity and repeatability are greatly related with the morphology of the deposited bismuth film. In this study, a flat and compact bismuth film on GC electrode was obtained by electro-plating in a electrolyte containing Bi³⁺ and Sn²⁺, but no Sn element was found in the obtained film owing to the deposition potential more positive than E_Sn2+/Sn. The contribution of Sn²⁺ to the change in the morphology of bismuth film was explained that the coexisted Sn²⁺ ions in the electrolyte blocked the migration of Bi³⁺ ions during the deposition since Sn²⁺ ions could not be deposited under such conditions, then the thickness of metal ion deficient layer (MIDL) near the substrate was weakened, allowing more flat and compact bismuth film grown. The resulted BiFE has broader working window and improved repeatability than BiFE with dendritic Bi film.