Effects of KIO4 concentration and pH values of the solution relevant for chemical mechanical polishing of ruthenium
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- 作者：Jie Cheng ; Tongqing Wang ; Jie Wang ; Yuhong Liu ; liuyuhong@tsinghua.edu.cn" class="auth_mail" title="E-mail the corresponding author ; Xinchun Lu ; xclu@tsinghua.edu.cn" class="auth_mail" title="E-mail the corresponding author
- 关键词：Ruthenium ; Chemical mechanical polishing (CMP) ; Potassium periodate (KIO4) ; Corrosion ; Electrochemistry
- 刊名：Microelectronic Engineering
- 出版年：2016
- 出版时间：5 February 2016
- 年：2016
- 卷：151
- 期：Complete
- 页码：30-37
- 全文大小：1728 K
文摘
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Corrosion of Ru is compared under different slurry pH values.
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CMP-chemical experiments are conducted under 3 different conditions.
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The corrosion of Ru is a mixed-controlled process under weak alkaline conditions.
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Weak alkaline slurry is optimal for it has good mechanical-enhanced chemical effect.
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