Influence of additives selected calix[4]arenes on electroless copper plating using hypophosphite as reducing agent

详细信息    查看全文

• 作者：N. M'hanni^a ; M. Galai^a ; T. Anik^a ; M. Ebn Touhami^a ; E.H. Rifi^b ; Z. Asfari^c ; R. Touir^a ; ^d ; ^{touir8@yahoo.fr} ; ^{touir8@gmail.com}
• 关键词：Electroless copper plating ; Calix[4]arenes additives ; Electrochemical measurements
• 刊名：Surface and Coatings Technology
• 出版年：2017
• 出版时间：25 January 2017
• 年：2017
• 卷：310
• 期：Complete
• 页码：8-16
• 全文大小：1645 K
• 卷排序：310

文摘

Ammonium chloride reacted as an accelerator for copper coating. Calix[4]arenes addition improved the quality of deposits. Structure and morphology of the coatings are depended on calix[4]arenes nature. Calix[4]arenes inhibited the electroless copper process reactions.