Dielectric thermally conductive boron nitride/polyimide composites with outstanding thermal stabilities via in-situ polymerization-electrospinning-hot press method

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• 作者：Junwei Gu<sup>asup><sup> ; sup><sup>gjw@nwpu.edu.cnsup> ; Zhaoyuan Lv<sup>asup><sup> ; sup><sup>1sup> ; Yalan Wu<sup>bsup><sup> ; sup><sup>1sup> ; Yongqiang Guo<sup>asup> ; Lidong Tian<sup>asup> ; Hua Qiu<sup>asup> ; Wanzheng Li<sup>asup> ; Qiuyu Zhang<sup>asup><sup> ; sup><sup>qyzhang1803@gmail.comsup>
• 关键词：A. Polymer-matrix composites (PMCs) ; B. Thermal properties ; C. Electrospinning ; D. Compression moulding
• 刊名：Composites Part A: Applied Science and Manufacturing
• 出版年：2017
• 出版时间：March 2017
• 年：2017
• 卷：94
• 期：Complete
• 页码：209-216
• 全文大小：2165 K
• 卷排序：94

文摘

Micrometer boron nitride/polyamide acid (mBN/PAA) compound was firstly fabricated via in-situ polymerization, performed to obtain the mBN/PAA electrospun fibers by electrospinning technology, finally to fabricate the dielectric thermally conductive mBN/polyimide (mBN/PI) composites via thermal-imidization followed by hot press method. The obtained mBN/PI composite with 30 wt% mBN presents relatively highly thermally conductive coefficient (λ), excellent dielectric constant (ε) & dielectric loss tangent (tan δ), and extremely outstanding thermal stability, λ of 0.696 W/m K, ε of 3.77, tan δ of 0.007, THeat-resistance index (THRI) of 279 °C and glass transition temperature (Tg) of 240 °C, which presents a great potential for packaging in integration and miniaturization of microelectronic devices.