Rigiflex, Spontaneously Wettable Polymeric Mold for Forming Reversibly Bonded Nanocapillaries

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• 作者：Pilnam Kim ; Kahp Y. Suh
• 刊名：Langmuir
• 出版年：2007
• 出版时间：April 10, 2007
• 年：2007
• 卷：23
• 期：8
• 页码：4549 - 4553
• 全文大小：407K
• 年卷期：v.23,no.8(April 10, 2007)
• ISSN：1520-5827

文摘

We present a novel ultraviolet (UV)-curable mold that enables the formation of reversibly bonded nanocapillaries(500-50 nm) on a gold or silicon substrate. A sheet-type (~50 m) polyethylene diacrylate (PEG-DA) mold wasused for its rigiflex nature; it provides rigidity high enough for maintaining nanostructures (elastic modulus >70 MPa)and also flexibility good enough for intimate contact over a large area aided by weak electrostatic forces (zeta potential -113.55 mW). The electrostatic charge is generated on a rigiflex PEG-DA mold upon peeling from an originalengraved silicon master by mechanical friction, thereby assisting the formation of spontaneous contact with the goldor silicon substrate.