Low-Dielectric, Nanoporous Organosilicate Films Prepared via Inorganic/Organic Polymer Hybrid Templates

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• 作者：Cattien V. Nguyen ; Kenneth R. Carter ; Craig J. Hawker ; James L. Hedrick ; Richard L. Jaffe ; Robert D. Miller ; Julius F. Remenar ; Hee-Woo Rhee ; Philip M. Rice ; Michael F. Toney ; Mikael Trollså ; s ; a
• 刊名：Chemistry of Materials
• 出版年：1999
• 出版时间：November 1999
• 年：1999
• 卷：11
• 期：11
• 页码：3080 - 3085
• 全文大小：155K
• 年卷期：v.11,no.11(November 1999)
• ISSN：1520-5002

文摘

Dielectric insulator materials containing nanometer-scale closed-cell pores with lowdielectric constants (k < 2.2), good mechanical properties, and high dielectric breakdownstrengths are required for future semiconductor devices. In this paper we present a novelmethod for preparing nanoporous polyorganosilicate films, which promise to satisfy the keyrequirements, via inorganic/organic polymer hybrid templating. The nanometer-scaleinorganic/organic polymer hybrids are generated in situ upon heating mixtures of methylsilsesquioxane (MSSQ) prepolymer with star-shaped hydroxy-terminated poly(fchars/epsilon.gif" BORDER=0 >-caprolactone)(PCL) to ~250 f">C, causing chain extension and cross-linking of MSSQ. Subsequent heatingto 430 f">C results in the thermal decomposition and volatilization of PCL components fromthe vitrified poly(methylsilsesquioxane) (PMSSQ) matrix, leaving behind porous PMSSQfilms with pores with the size and shape of the original hybrid morphology. A dielectricconstant as low as 2.1 has been achieved for closed-cell nanoporous PMSSQ films withhydrophobic surfaces and excellent breakdown strengths close to that of SiO₂. Moreover,conductance measurements on inorganic/organic polymer hybrids offer insight into thedevelopment of interconnected PCL domains as the PCL content is increased above ~25%.