Postpolymerization of Functional Organosiloxanes: An Efficient Strategy for Preparation of Low-k Material with Enhanced Thermostability and Mechanical Properties

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• 作者：Chao Yuan ; Jiajia Wang ; Kaikai Jin ; Shen Diao ; Jing Sun ; Jiawei Tong ; Qiang Fang
• 刊名：Macromolecules
• 出版年：2014
• 出版时间：September 23, 2014
• 年：2014
• 卷：47
• 期：18
• 页码：6311-6315
• 全文大小：351K
• ISSN：1520-5835

文摘

A novel functional oligomer (Si-TFVE) with a siloxane backbone and thermally cross-linkable trifluorovinyl ether groups (鈭扥CF鈺怌F₂) is reported here. When postpolymerized at high temperature, Si-TFVE converts to an amorphous cross-linked network (Si-PFCB), which shows a dielectric constant of 2.33 and dielectric loss below 2.1 脳 10^鈥? at 30 MHz. Si-PFCB also shows excellent film uniformity with the surface roughness less than 5.79 nm over a 1 渭m square area. Moreover, Si-PFCB shows high thermostability with a 5 wt % loss temperature of 472 掳C and no obvious T_g below 350 掳C. In regard to the mechanical properties, Si-PFCB has Young鈥檚 modulus, hardness, and bonding strength with silicon wafer surface of 10.06 GPa, 0.392, and 4.93 GPa, respectively. These results suggest that such oligomer is suitable for utilization in ultralarge scale integration circuits. In addition, this contribution provides a new route to prepare cross-linked organosiloxanes only by heating instead of using catalysts or initiators in the traditional procedures.