Enhancing the Reactivity of Al/CuO Nanolaminates by Cu Incorporation at the Interfaces

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• 作者：Lorena Mar铆n ; Charith E. Nanayakkara ; Jean-Francois Veyan ; B茅n茅dicte Warot-Fonrose ; S茅bastien Joulie ; Alain Est猫ve ; Christophe Tenailleau ; Yves J. Chabal ; Carole Rossi
• 刊名：ACS Applied Materials & Interfaces
• 出版年：2015
• 出版时间：June 10, 2015
• 年：2015
• 卷：7
• 期：22
• 页码：11713-11718
• 全文大小：379K
• ISSN：1944-8252

文摘

In situ deposition of a thin (鈭? nm) layer of copper between Al and CuO layers is shown to increase the overall nanolaminate material reactivity. A combination of transmission electron microscopy imaging, in situ infrared spectroscopy, low energy ion scattering measurements, and first-principles calculations reveals that copper spontaneously diffuses into aluminum layers (substantially less in CuO layers). The formation of an interfacial Al:Cu alloy with melting temperature lower than pure Al metal is responsible for the enhanced reactivity, opening a route to controlling the stochiometry of the aluminum layer and increasing the reactivity of the nanoenergetic multilayer systems in general.