Photolithography-Based Patterning of Liquid Metal Interconnects for Monolithically Integrated Stretchable Circuits

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• 作者：Chan Woo Park ; Yu Gyeong Moon ; Hyejeong Seong ; Soon Won Jung ; Ji-Young Oh ; Bock Soon Na ; Nae-Man Park ; Sang Seok Lee ; Sung Gap Im ; Jae Bon Koo
• 刊名：ACS Applied Materials & Interfaces
• 出版年：2016
• 出版时间：June 22, 2016
• 年：2016
• 卷：8
• 期：24
• 页码：15459-15465
• 全文大小：472K
• 年卷期：0
• ISSN：1944-8252

文摘

We demonstrate a new patterning technique for gallium-based liquid metals on flat substrates, which can provide both high pattern resolution (∼20 μm) and alignment precision as required for highly integrated circuits. In a very similar manner as in the patterning of solid metal films by photolithography and lift-off processes, the liquid metal layer painted over the whole substrate area can be selectively removed by dissolving the underlying photoresist layer, leaving behind robust liquid patterns as defined by the photolithography. This quick and simple method makes it possible to integrate fine-scale interconnects with preformed devices precisely, which is indispensable for realizing monolithically integrated stretchable circuits. As a way for constructing stretchable integrated circuits, we propose a hybrid configuration composed of rigid device regions and liquid interconnects, which is constructed on a rigid substrate first but highly stretchable after being transferred onto an elastomeric substrate. This new method can be useful in various applications requiring both high-resolution and precisely aligned patterning of gallium-based liquid metals.