High-Performance, Solution-Processed, Embedded Multiscale Metallic Transparent Conductors

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• 作者：Yong Suk Oh ; Hyunwoo Lee ; Dong Yun Choi ; Sung-Uk Lee ; Hojin Kim ; Seunghyup Yoo ; Inkyu Park ; Hyung Jin Sung
• 刊名：ACS Applied Materials & Interfaces
• 出版年：2016
• 出版时间：May 4, 2016
• 年：2016
• 卷：8
• 期：17
• 页码：10937-10945
• 全文大小：510K
• 年卷期：0
• ISSN：1944-8252

文摘

High-performance multiscale metallic transparent conductors (TCs) are demonstrated by incorporating Ag nanowire (NW) networks into microscale Ag grid structures. Highly conductive Ag grids are fabricated via direct imprinting of an Ag ion ink using a reservoir-assisted mold. In this mold, a macroscale cavity, called the “reservoir”, is designed to connect to a grid-patterned cavity. The reservoir has a large cavity volume, which reduces unwanted residual layers within the grid spacings by introducing a thinner liquid film. The reservoir undergoes a large volume reduction during mold deformation, which improves ink filling within the grid-patterned cavity through deformation-induced ink injection. The multiscale metallic TCs show a sheet resistance (R_s) of <1.5 Ω/sq and a transmittance (T) of 86% at 550 nm, superior to the corresponding values of Ag NW networks (R_s of 15.6 Ω/sq at a similar T). We estimate the R_s–T performances of the Ag grids using geometrical calculations and demonstrate that their integration can enhance the opto-electrical properties of the Ag NW networks. Multiscale metallic TCs are successfully transferred and embedded into a transparent, flexible, and UV-curable polymer matrix. The embedded multiscale metallic TCs show reasonable electromechanical and chemical stability. The utility of these TCs is demonstrated by fabricating flexible organic solar cells.