Microstructures and Mechanical Properties of Sn-0.1Ag-0.7Cu-(Co, Ni, and Nd) Lead-Free Solders
详细信息 查看全文
- 作者：Xu Chen ; Jian Zhou ; Feng Xue ; Jing Bai ; Yao Yao
- 关键词：Lead ; free solder ; Sn ; Ag ; Cu ; microstructure ; mechanical properties
- 刊名：Journal of Electronic Materials
- 出版年：2015
- 出版时间：February 2015
- 年：2015
- 卷：44
- 期：2
- 页码：725-732
- 全文大小：1,892 KB
- 参考文献：1. J.J. Sundelina, S.T. Nurmib, T.K. Lepist?, and E.O. Ristolainen, / Mater. Sci. Eng. A 420, 55 (2006). CrossRef
2. K. Kanlayasiria and T. Ariga, / J. Alloys Compd. 504, L5 (2010). CrossRef
3. W.R. Osório, L.C. Peixoto, L.R. Garcia, N. Mangelinck-No?l, and A. Garcia, / J. Alloys Compd. 572, 97 (2013). CrossRef
4. X.Y. Zhao, M.Q. Zhao, X.Q. Cui, T.H. Xu, and M.X. Tong, / Chin. J. Nonferrous Met. 17, 805 (2007). CrossRef
5. K. Kanlayasiria, M. Mongkolwongrojnb, and T. Arigac, / J. Alloys Compd. 485, 225 (2009). CrossRef
6. L.W. Lin, J.M. Song, Y.S. Lai, Y.T. Chiu, N.C. Lee, and J.Y. Uand, / Microelectron. Reliab. 49, 235 (2009). CrossRef
7. F.J. Cheng, F. Gao, J.Y. Zhang, W.S. Jin, and X. Xiao, / J. Mater. Sci. 46, 3424 (2011). CrossRef
8. I.E. Anderson, J.C. Foley, B.A. Cook, J. Harringa, R.L. Terpstra, and O. Unal, / J. Electron. Mater. 30, 1050 (2001). CrossRef
9. Y. Liu, F.L. Sun, and Y. Liu, / J. Mater. Sci. 24, 290 (2013).
10. L.L. Gao, S.B. Xue, L. Zhang, Z. Sheng, F. Ji, W. Dai, S.L. Yu, and G. Zeng, / Microelectron. Eng. 87, 2025 (2010). CrossRef
11. Y.W. Wang, Y.W. Lin, C.T. Tu, and C.R. Kao, / J. Alloys Compd. 478, 121 (2009). CrossRef
12. F. Gao, T. Takemoto, and H. Nishikawa, / Mater. Sci. Eng. A 420, 39 (2006). CrossRef
13. I.E. Anderson, B.A. Cook, J. Harringa, and R.L. Terpstra, / J. Electron. Mater. 31, 1166 (2002). CrossRef
14. W.J. Zhu, H.S. Liu, J.S. Wang, H.Q. Dong, and Z.P. Jin, / J. Alloys Compd. 481, 503 (2009). CrossRef
15. Y.W. Wang, C.C. Chang, and C.R. Kao, / J. Alloys Compd. 478, L1 (2009). CrossRef
16. J.M. Song, C.F. Huang, and H.Y. Chuang, / J. Electron. Mater. 35, 2154 (2006). CrossRef
17. X. Zhao, M. Saka, M. Yamashita, and H. Hokazono, / Microsyst. Technol. 18, 2077 (2012). CrossRef
18. ASTM, / E 8M: Standard Test Methods for Tension Testing of Metallic Materials (West Conshohocken: ASTM International, 2004).
19. W.R. Osorio, D.R. Leiva, L.C. Peixoto, L.R. Garcia, and A. Garcia, / J. Alloys Compd. 562, 194 (2013). CrossRef
20. L.R. Garcia, W.R. Osório, and A. Mater, / Design 32, 3008 (2011). CrossRef
21. S. Fürtauer, D. Li, D. Cupid, and H. Flandorfer, / Intermetallics 34, 142 (2013). CrossRef
22. S. Chen, S. Lee, and M. Yip, / J. Electron. Mater. 32, 1284 (2003). CrossRef
23. K. Nogita, / Intermetallics 18, 145 (2010).
文摘
The influences of minor alloying elements Co, Ni, and Nd on the microstructures and mechanical properties of Sn-0.1Ag-0.7Cu (SAC0107) solder were investigated. The results show that the microstructures of SAC0107 alloy mainly consisted of primary Sn-rich phases and eutectic phases composed of Ag3Sn and Cu6Sn5 phases dispersed in a Sn matrix. With Co or Ni additions, the amount of primary Sn-rich phase reduced and IMCs dispersed more uniformly in the Sn matrix. The elements of Co and Ni were concentrated in (Co x Cu1?em class="a-plus-plus">x )6Sn5 and (Ni x Cu1?em class="a-plus-plus">x )6Sn5 intermetallic compounds (IMCs), respectively, and they also entered the IMC layer between solder alloys and Cu substrate during soldering. Shear strength of the joints all increased by adding Co, Ni, and Nd elements. Different from the Co and Nd additions, the addition of the Ni element also markedly improved the tensile strength and elongation of SAC0107 alloys.
© 2004-2018 中国地质图书馆版权所有 京ICP备05064691号 京公网安备11010802017129号 地址：北京市海淀区学院路29号 邮编：100083 电话：办公室：(+86 10)66554848；文献借阅、咨询服务、科技查新：66554700 |