用户名: 密码: 验证码:
Extended Aging of Ag/W Circuit Breaker Contacts: Influence on Surface Structure, Electrical Properties, and UL Testing Performance
详细信息    查看全文
  • 作者:Haibo Yu ; M. Tumerkan Kesim ; Yu Sun…
  • 关键词:aging ; circuit breaker contacts ; contact resistance ; electron microscopy ; UL testing
  • 刊名:Journal of Materials Engineering and Performance
  • 出版年:2016
  • 出版时间:January 2016
  • 年:2016
  • 卷:25
  • 期:1
  • 页码:91-101
  • 全文大小:3,474 KB
  • 参考文献:1.J.J. Shea, Erosion and Resistance Characteristics of AgW and AgC Contacts, IEEE Trans. Compon. Packag. Technol., 1999, 22(2), p 331–336CrossRef
    2.F. Findik and H. Uzun, Microstructure, Hardness and Electrical Properties of Silver-Based Refractory Contact Materials, Mater. Des., 2003, 24(7), p 489–492CrossRef
    3.C.-H. Leung and P.C. Wingert, Microstructure Effects on Dynamic Welding of Ag/W Contacts, IEEE Trans. Compon. Hybrids Manuf. Technol., 1988, 11(1), p 64–67CrossRef
    4.C.-H. Leung, P.C. Wingert, and H.J. Kim, Comparison of Reignition Properties of Several Ag/W, Ag/WC, and Ag/Mo Electrical Contact Materials, IEEE Trans. Compon. Hybrids Manuf. Technol., 1986, 9(1), p 86–91CrossRef
    5.P.V. Minakova, M.L. Grekova, A.P. Kresanov, and L.A. Kryachko, Composites for Contacts and Electrodes (A Review), Powder Metall. Met. Ceram., 1995, 34(7–8), p 370–385
    6.P.G. Slade, Variations in Contact Resistance Resulting from Oxide Formation and Decomposition in Ag-W and Ag-WC-C Contacts Passing Steady Currents for Long Time Periods, IEEE Trans. Compon. Hybrids Manuf. Technol., 1986, 9(1), p 3–16CrossRef
    7.C.-H. Leung and H.J. Kim, A Comparison of Ag/W, Ag/WC, and Ag/Mo Electrical Contacts, IEEE Trans. Compon. Hybrids Manuf. Technol., 1984, 7(1), p 69–75CrossRef
    8.H. Yu, Y. Sun, M.T. Kesim, J. Harmon, J. Potter, S.P. Alpay, and M. Aindow, Surface Degradation of Ag/W Circuit Breaker Contacts During Standardized UL Testing, J. Mater. Eng. Perform., 2015, 24(9), p 3251–3262CrossRef
    9.P.G. Slade, Effect of the Electric Arc and the Ambient Air on the Contact Resistance of Silver, Tungsten, and Silver-Tungsten Contacts, J. Appl. Phys., 1976, 47(8), p 3438–3443CrossRef
    10.R. Michal and K.E. Saeger, Application of Silver-Based Contact Materials in Air-Break Switching Devices for Power Engineering, Proceedings of the 34th IEEE Holm Conference on Electrical Contacts, September 26–29, 1988, p 121–127
    11.P.C. Wingert, The Detection and Effects of Oxide Layers on Silver-Refractory Contact Surfaces, Proceedings of the 43rd IEEE Holm Conference on Electrical Contacts, October 20–22, 1997, p 104–114
    12.P.G. Slade, Y.K. Chien, and J.A. Bindas, Switching Performance of AgW-Ag(Sn, In)O and AgW-AgSnO2 Contact Pairs, Proceedings of the 35th IEEE Holm Conference on Electrical Contacts, September 18–20, 1989, p 53–67
    13.C.-H. Leung, E. Streicher, and D. Fitzgerald, Weibull Analysis of Switching Contact Resistance in Laboratory and Commercial Circuit Breakers, Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts, September 16–19, 2007, p 56–62
    14.P.G. Slade, The Switching Performance of Refractory Carbide-Silver Contacts, IEEE Trans. Compon. Hybrids Manuf. Technol., 1979, 2(1), p 127–133CrossRef
    15.P.G. Slade and J.A. Bindas, Contact Resistance Variations of Tungsten Contacts Operated in Air and Silver-Tungsten Carbide Contacts Operated in Vacuum, Proceedings of the 36th IEEE Holm Conference on Electrical Contacts and the 15th International Conference on Electrical Contacts, August 20–24, 1990, p 530–537
    16.P. Borkowski, E. Walczuk, K. Frydman, and D. Wojcik-Grzybek, Switching Properties of Contacts Made of Silver-Tungsten and Silver-Tungsten-Rhenium Composite Materials, Proceedings of the 59th IEEE Holm Conference on Electrical Contacts, September 22–25, 2013, p 1–10
    17.M. Lindmayer and M. Roth, Contact Resistance and Arc Erosion of W/Ag and WC/Ag, IEEE Trans. Compon. Hybrids Manuf. Technol., 1979, 2(1), p 70–75CrossRef
    18. Standard for Safety, Molded-Case Circuit Breakers, Molded-Case Switches, and Circuit-Breaker Enclosures, ANSI/UL Standard 489, 1996
    19.Z. Aslanoglu, Y. Karakaş, M.L. Öveçoglu, and B. Özkal, Effects of Nickel Addition on Properties of Ag-W Electrical Contact Materials, Powder Metall., 2001, 44(1), p 77–81CrossRef
    20.G.J. Witter and W.R. Warke, A Correlation of Material Toughness, Thermal Shock Resistance, and Microstructure of High Tungsten, Silver-Tungsten Composite Materials, IEEE Trans. Parts Hybrids Packag., 1975, 11(1), p 21–29CrossRef
    21.C.W. Corti, Sintering Aids in Powder Metallurgy, Platin. Met. Rev., 1986, 30(4), p 184–195
    22.H. Yu, Y. Sun, S.P. Alpay, and M. Aindow, Microstructure Effects in Braze Joints Formed Between Ag/W Electrical Contacts and Sn-Coated Cu using Cu-Ag-P Filler Metal, J. Mater. Sci., 2015, 50(1), p 324–333CrossRef
    23. Standard Practice for Construction and Use of a Probe for Measuring Electrical Contact Resistance, ASTM Standard B 667-97, 2009
    24.J. Shea and J.A. Bindas, Measuring Molded Case Circuit Breaker Resistance, IEEE Trans. Compon. Hybrids Manuf. Technol., 1993, 16(2), p 196–202CrossRef
    25.Y. Cudennec, A. Lecerf, A. Riou, and Y. Gerault, Synthesis and Study of Copper Ammine Hydroxide and Copper Hydroxide, Hydrates, Eur. J. Solid. State Inorg. Chem., 1990, 27, p 411–420
    26.R. Diehl, G. Brandt, and E. Salje, The Crystal Structure of Triclinic WO3, Acta Crystallogr. Sect. B, 1978, 34, p 1105–1111CrossRef
    27.P.M. Skarstad and S. Geller (W4O16)8– Polyion in the High Temperature Modification of Silver Tungstate, Mater. Res. Bull., 1975, 10(8), p 791–800CrossRef
    28.B.M. Gatehouse and P. Leverett, Crystal Structures of Silver Dimolybdate, Ag2Mo2O7, and Silver Ditungstate, Ag2W2O7, J. Chem. Soc. Dalton, 1976, 5, p 1316–1320CrossRef
    29.S.S. Kabalkina, S.V. Popova, N.R. Serebryanaya, and L.F. Vereshchagin, A New Modification of Ag2O with Layered Structure, Dokl. Akad. Nauk SSSR, 1963, 152, p 853–854
    30.M. Antler, Survey of Contact Fretting in Electrical Connectors, IEEE Trans. Compon. Hybrids Manuf. Technol., 1985, 8(1), p 87–104CrossRef
    31.A. Beloufa, Conduction Degradation by Fretting Corrosion Phenomena for Contact Samples Made of High-Copper Alloys, Tribol. Int., 2010, 43(11), p 2110–2119CrossRef
    32.I.H. Brockman, C.S. Sieber, and R.S. Mroczkowski, A Limited Study of the Effects of Contact Normal Force, Contact Geometry and Wipe Distance on the Contact Resistance of Gold-Plated Contacts, Proceedings of the 38th Electronics Components Conference, May 9–11, 1988, p 198–207
    33.P.C. Wingert, The Effects of Nickel on the Switching Performance of Silver-Tungsten-Based Contacts, Proceedings of the 39th IEEE Holm Conference on Electrical Contacts, September 27–29, 1993, p 111–115
    34.J.J. Shea, Polymeric Arc Chamber Walls Influence on AGW/AGC Contact Resistance, IEEE Trans. Compon. Packag. Technol., 2000, 23(2), p 205–210CrossRef
    35.N. Kaneki, H. Hara, K. Shimada, and T. Shimizu, Effect of Atmosphere on Resistivity of WO3 Ceramics, J. Am. Ceram. Soc., 1976, 59(7–8), p 368–369CrossRef
    36.Y. Abe, T. Hasegawa, M. Kawamura, and K. Sasaki, Characterization of Ag Oxide Thin Films Prepared by Reactive RF Sputtering, Vacuum, 2004, 76(1), p 1–6CrossRef
    37.A. Sreedevi, K.P. Priyanka, S.R. Mary, E.M. Mohammed, and T. Varghese, Nanophase α-Silver Tungstate for Potential Applications in Light Emitting Diodes and Gate Dielectrics, Adv. Sci. Eng. Med., 2015, 7(6), p 498–505CrossRef
  • 作者单位:Haibo Yu (1)
    M. Tumerkan Kesim (1)
    Yu Sun (1)
    Jason Harmon (2)
    Jonathan Potter (2)
    S. Pamir Alpay (1)
    Mark Aindow (1)

    1. Department of Materials Science and Engineering, Institute of Materials Science, University of Connecticut, Storrs, CT, 06269-3136, USA
    2. GE Energy Management - Industrial Solutions, Plainville, CT, 06062, USA
  • 刊物类别:Chemistry and Materials Science
  • 刊物主题:Chemistry
    Characterization and Evaluation Materials
    Materials Science
    Tribology, Corrosion and Coatings
    Quality Control, Reliability, Safety and Risk
    Engineering Design
  • 出版者:Springer New York
  • ISSN:1544-1024
文摘
Samples of 120 V, 30 A commercial circuit breakers were subjected to various aging treatments and the resulting microstructures at the surfaces of the Ag/W contacts were studied using a combination of x-ray diffraction, scanning electron microscopy, and energy-dispersive x-ray spectroscopy techniques. Breakers aged naturally in a hot, humid climate were compared to those subjected to accelerated aging in dry and humid environments. The most extensive oxidation was observed for contacts from breakers subjected to accelerated humid aging; these contacts exhibited thick surface layers consisting of Ag2O, Ag2WO4, Cu(OH)2∙H2O, and WO3 phases. Far less surface degradation was observed for dry-aged contacts. Naturally aged contacts showed variations in degradation with more oxidation at the surface regions outside the physical contact area on the contact face. A correlation was found between the contact resistances measured from these samples following ASTM standard B 667-97 and the observed surface microstructures. To evaluate the effects of the surface oxides on breaker performance, humid-aged breakers were subjected to standardized UL overload/temperature-rise, endurance, and short-circuit testing following UL489. The contacts in these breakers exhibit similar microstructural and property changes to those observed previously for as-manufactured contacts after UL testing. These data illustrate the robust performance of this contact technology even after being subjected to aggressive artificial aging.

© 2004-2018 中国地质图书馆版权所有 京ICP备05064691号 京公网安备11010802017129号

地址:北京市海淀区学院路29号 邮编:100083

电话:办公室:(+86 10)66554848;文献借阅、咨询服务、科技查新:66554700