3D打印技术及其在电子元器件领域的应用
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摘要
电子元器件是电子设备的基础与核心,对电子设备微型化、集成化的发展起到至关重要的作用,但传统的制造方法在提高电容器元器件功率密度和能量密度方面存在难以逾越的鸿沟。在电子元器件制造中引入3D打印增材制造技术不仅能够突破传统加工制造技术的瓶颈,还可以实现电子电路性能的提升和特性化制造,目前已成功地打印出了功能性电子组件和电路。因此,结合3D打印原理和打印方法的分析,并以3D打印固体钽电容阳极块为例,详细阐述3D打印技术在电子元器件领域应用的技术难点和解决方法,以示3D打印技术在电子元器件领域具有广阔的应用前景。
Electronic components are the basis and core of electronic devices,which play a vital role in the miniaturization and integration of electronic devices.However,there is an insurmountable gap for traditional manufacturing methods to improve the power and energy density of the components.The application of 3 D printing technology in electronic components manufacturing can not only break through the bottleneck of traditional manufacturing technology,but also improve the performance of electronic circuits and achieve characteristic manufacturing.Nowadays functional electronic components and circuits have been successfully printed.Based upon the 3 D printing principle and method,the technical difficulties and solutions of 3 D printing technology in electronic components,by taking solid tantalum capacitor anode as an example,are elaborated in detail,which show great potentials of 3 D printing technology in electronic components.
Electronic components are the basis and core of electronic devices,which play a vital role in the miniaturization and integration of electronic devices.However,there is an insurmountable gap for traditional manufacturing methods to improve the power and energy density of the components.The application of 3 D printing technology in electronic components manufacturing can not only break through the bottleneck of traditional manufacturing technology,but also improve the performance of electronic circuits and achieve characteristic manufacturing.Nowadays functional electronic components and circuits have been successfully printed.Based upon the 3 D printing principle and method,the technical difficulties and solutions of 3 D printing technology in electronic components,by taking solid tantalum capacitor anode as an example,are elaborated in detail,which show great potentials of 3 D printing technology in electronic components.
引文
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[4]周德俭.3D打印电子产品技术发展现状探析[J].电子机械工程,2017,33(2):14-17.
[5]谷涌泉,武欣.3D打印技术在血管外科的应用[J].中国修复重建外科杂志,2014(3):276-278.
[6]王磊.3D打印技术的发展与应用[J].内燃机与配件,2017(22):144-146.
[7]范峥睿,马信龙,马剑雄,等.3D打印在骨科手术中的应用及其前景[J].中华创伤骨科杂志,2017,19(10):886-891.
[8]王筱雪,姚春.3D打印技术在电子信息领域的应用[J].信息系统工程,2015(5):93-94.
[9]张春梅.电子元器件研发中的3D打印技术应用研究[J].科技展望,2016,26 (36):126.
[10]杨邦朝,胡永达.LTCC技术的现状和发展[J].电子元件与材料,2014,33(11):5-9.
[11]Sun K,Wei T S,Ahn B Y,et al.3D printing of interdigitated Li-ion microbattery architectures [J].Advanced Materials,2013,25(33):4539-4543.
[12]古良玲,全晓莉.3D打印技术在电子元器件研制中的应用展望[J].电子元件与材料,2014,33(1):67-68.
[13]Jiang H,Kang X P.Analysis in development of 3D printing technology[J].Advanced Materials Industry,2013(10):30-55.
[14]Yu D M,Fang A,Zhang J B.3D printing:technology and application[J].Metal World,2013(6):6-11.
[15]Guo C B,Hu L R,Hu D D,et al.3D printing technology and recent application in military fields[J].Tactical Missile Technology,2013(6):6-11.
[16]高上,张人佶,杨伟东,等.基于PMAC的无模铸造工艺的控制系统设计[J].组合机床与自动化加工技术,2004(10):51-52.
[17]蒲以松,王宝奇,张连贵.金属3D打印技术的研究[J].表面技术,2018(3):78-84.
[18]Cesarano J,Segalman R,Calvert P.Robocasting provides moldless fabrication from slurry deposition[J].Industrial Ceramics,1998,148(4):94-102.
[19]Chen X L,Liu X H,Billy W,et al.A low cost desktop electrochemical metal 3D printer[J].Advanced Materials Technologies,2017(1700148):1-6.
[20]Du Y,Chen J G,Liu Xin,et al.Flexible n-type tungsten carbide/polylactic acid thermoelectric composites fabricated by additive manufacturing[J].Coatings,2018(8):25.
[21]夏耀勤,王敬生.钽电容器的应用现状和展望[J].电子元件与材料,1999,18(2):36-38.
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