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Wiley电子期刊(4)	ProQuest学位论文(21)	Elsevier电子期刊(512)
SpringerLink电子期刊(251)	NATURE电子期刊(1)	ACS电子期刊(18)

在“Elsevier电子期刊”中，命中：512条，耗时：0.040981 秒

在所有数据库中总计命中：807条

1.Enhanced light extraction efficiency of chip-on board light-emitting diodes through micro-lens array fabricated by ion wind

作者：Jingcao Chu^a ; Xiang Lei^a ; Jiading Wu^a ; Yang Peng^a ; Sheng Liu^b ; Qian Yang^b ; Huai Zheng^b ; ^{Huai_zheng@whu.edu.cn" class="auth_mail" title="E-mail the corresponding author}

关键词：Light-emitting diodes (LEDs) ; Micro-lens array ; Chip-on board (COB) packaging ; Light extraction efficiency (LEE) ; Ion wind

刊名：Optics & Laser Technology

出版年：2017

2.Design and rationale of Heart and Lung Failure - Pediatric INsulin Titration Trial (HALF-PINT): A randomized clinical trial of tight glycemic control in hyperglycemic critically ill children

作者：Michael SD Agus^a ; ^{michael.agus@childrens.harvard.edu} ; Ellie Hirshberg^b ; ^{ellie.hirshberg@hsc.utah.edu} ; Vijay Srinivasan^c ; ^{srinivasan@email.chop.edu} ; Edward Vincent Faustino^d ; ^{vince.faustino@yale.edu} ; Peter M Luckett^e ; ^{peter.luckett@childrens.com} ; Martha AQ Curley^f ; ^{curley@nursing.upenn.edu} ; Jamin Alexander^a ; ^{jamin.alexander@childrens.harvard.edu} ; Lisa A Asaro^g ; ^{lisa.asaro@cardio.chboston.org} ; Kerry Coughlin-Wells^a ; ^{kerry.coughlin-wells@childrens.harvard.edu} ; Donna Duva^g ; ^{donna.duva@cardio.chboston.org} ; Jaclyn French^a ; ^{jaclyn.french@childrens.harvard.edu} ; Natalie Hasbani^g ; ^{natalie.hasbani@childrens.harvard.edu} ; Martha T Sisko^c ; ^{siskom@email.chop.edu} ; Carmen L Soto-Rivera^a ; ^{carmen.soto@childrens.harvard.edu} ; Garry Steil^a ; ^{garry.steil@childrens.harvard.edu} ; David Wypij^g ; ^{david.wypij@cardio.chboston.org} ; Vinay M Nadkarni^c ; ^{nadkarni@email.chop.edu}

关键词：BG ; blood glucose ; CBCL ; Child Behavior Checklist ; CCC ; Clinical Coordinating Center ; CGM ; continuous glucose monitor ; CHECKS ; Children's Hospital EuglyCemia for Kids Spreadsheet ; CHiP ; Control of Hyperglycaemia in Paediatric intensive care ; DCC ; Data Coordinating Center ; DSMB ; Data and Safety Monitoring Board ; FDA ; Food and Drug Administration ; ICU ; Intensive Care Unit ; IRB ; Institutional Review Board ; LOS ; length of stay ; NASA-TLX ; National Aeronautics and Space Administration-Task Load Index

刊名：Contemporary Clinical Trials

出版年：2017

3.Improvement in optical performance and color uniformity by optimizing the remote phosphor caps geometry for chip-on-board light emitting diodes

作者：Jiasheng Li^a ; Zongtao Li^a ; ^b ; ^{meztli@scut.edu.cn" class="auth_mail" title="E-mail the corresponding author} ; Zhi Li^a ; Yong Tang^a ; Xinrui Ding^c ; Binhai Yu^a

关键词：Remote phosphor ; Chip-on board (COB) ; Light-emitting diodes (LEDs) ; Optical performance ; Color uniformity

刊名：Solid State Electronics

出版年：2016

4.Low-temperature low-cost 58 Bismuth - 42 Tin alloy forensic chip re-balling and re-soldering

作者：Th. Heckmann^a ; ^b ; ^{thibaut.heckmann@gendarmerie.interieur.gouv.fr} ; Th. Souvignet^a ; ^b ; ^{thomas.souvignet@gendarmerie.interieur.gouv.fr} ; S. Lepeer^a ; ^{sebastien.lepeer@gendarmerie.interieur.gouv.fr} ; D. Naccache^b ; ^{david.naccache@ens.fr}

关键词：Forensic rework ; Chip reflow ; Hardware forensics

刊名：Digital Investigation

出版年：2016

5.Study on the Ignition Capability of Welding Slag to B2 Grade Polystyrene Extruded Board

作者：Yu-xiao Liu^a ; Jing Jin^b ; ^{ahu_jinjing@126.com" class="auth_mail" title="E-mail the corresponding author} ; Jin-zhuan Zhang^b

关键词：welding slag ; B2 grade polystyrene extruded board ; ignition capability

刊名：Procedia Engineering

出版年：2016

6.Fully printable chipless RFID multi-parameter sensor

作者：Emran M. Amin^a ; ^{emran.amin@monash.edu" class="auth_mail" title="E-mail the corresponding author}Author Vitae ; Nemai C. Karmakar^a (A/Prof.)Author Vitae ; Bjø ; rn W. Jensen^b (Prof.)Author Vitae

关键词：Chipless RFID ; Microwave resonator ; Passive sensor ; Humidity ; Temperature

刊名：Sensors and Actuators A: Physical

出版年：2016

7.Drop failure modes of Sn-3.0Ag-0.5Cu solder joints in wafer level chip scale package

作者：Ming-liang HUANG^a ; ^{huang@dlut.edu.cn" class="auth_mail" title="E-mail the corresponding author} ; Ning ZHAO^a ; Shuang LIU^a ; Yi-qian HE^b

关键词：Sn&ndash ; 3.0Ag&ndash ; 0.5Cu ; wafer level chip scale package ; solder joint ; drop failure mode

刊名：Transactions of Nonferrous Metals Society of China

出版年：2016

8.Design of a multi-frequency Bio-Impedance Spectroscopy system Analog Front-End and Digital Back-End with system on-chip implementation

作者：Wen-Yaw Chung^a ; ^{eldanny@cycu.edu.tw" class="auth_mail" title="E-mail the corresponding author} ; Angelito A. Silverio^a ; Vincent F.S. Tsai^b ; ^c ; Cheanyeh Cheng^d ; Shu-Yu Chang^a ; Ming-Ying Zhou^a ; Si-Yuan Chen^e ; Chi-Ying Kao^d ; Dan Arcega Rustia^a ; Yi-Wen Lo^a

关键词：Bio-Impedance Spectroscopy (BIS) ; Voltage Controlled Current Source (VCCS) ; Differential Voltage Current Conveyor (DVCC) ; System-on-Chip (SoC) ; Conductometric Sensor ; Urine conductivity

刊名：Microelectronics Journal

出版年：2016

9.On-chip Feedthrough Cancellation Technique for Enhanced Electrical Characterization of a Piezoelectric MEMS Resonator in Water

作者：Abid Ali^a ; ^{abidali2-c@my.cityu.edu.hk} ; Joshua E.-Y. Lee^a ; ^b

关键词：AlN-on-silicon ; MEMS resonator ; Feedthrough cancellation ; Quality factor ; Differential inputs

刊名：Procedia Engineering

出版年：2016

10.A low-cost platform for the prototyping and characterization of digital circuit IPs

作者：Muhammad E.S. Elrabaa^a ; ^{elrabaa@kfupm.edu.sa" class="auth_mail" title="E-mail the corresponding author}Author Vitae ; Amran Al-Aghbari^a ; Mohammad Al-Asli^a ; Aiman El-Maleh^a ; Abdelhafid Bouhraoua^a ; Mohammad Alshayeb^b

关键词：Circuit intellectual properties ; Test and characterization ; Test processors ; ASICs ; Systems-on-Chip (SOCs)

刊名：Integration, the VLSI Journal

出版年：2016

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